1MM-R-D06-VS-00-F-TBP

TE Connectivity
571-1MMRD06VS00FTBP
1MM-R-D06-VS-00-F-TBP

Mfr.:

Description:
Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 012 SMT G1 TBK

ECAD Model:
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In Stock: 1.151

Stock:
1.151 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp51.919 Rp51.919
Rp49.718 Rp1.242.950
Rp48.433 Rp2.421.650
Rp36.325 Rp2.906.000
Rp28.987 Rp16.232.720
Rp28.436 Rp34.123.200

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Receptacles
12 Position
1 mm (0.039 in)
2 Row
Solder
Vertical
1 A
30 VAC
- 55 C
+ 125 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
Tube
Brand: TE Connectivity
Flammability Rating: UL 94 V-0
Insulation Resistance: 500 MOhms, 1 GOhms
Mounting Style: SMD/SMT
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 80
Subcategory: Board to Board & Mezzanine Connectors
Part # Aliases: 2267465-6
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Attributes selected: 0

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CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.