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2057737-3

Name: TE Connectivity 2057737-3
Brand: TE Connectivity
SKU: 571-2057737-3
Price: 210612 IDR
Availability: InStock

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Mouser No:

571-2057737-3

Mfr. No:

2057737-3

Mfr.:

TE Connectivity

Description:

High Speed/Modular Connectors IMP100 S H V2P16C LT-GUIDE OPEN-WALL

Datasheet:

2057737-3 Datasheet

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Learn more about TE Connectivity 2057737-3

Availability

Stock:: An unexpected error occurred. Please try again later.

2.600 Can Dispatch in 20 Days

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Minimum: 650 Multiples: 650

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp210.612	Rp136.897.800
2.600	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	High Speed/Modular Connectors
Number of Positions:	96 Position
Number of Rows:	6 Row
Pitch:	1.9 mm
Contact Plating:	Gold
Series:	IMPACT Backplane
Brand:	TE Connectivity
Current Rating:	750 mA
Housing Colour:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	13
Subcategory:	Backplane Connectors
Voltage Rating:	120 V

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Datasheet

2057737-3 Datasheet

Images

RoHS Certificate (PDF)

Compliance Codes

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536699099
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

IMPACT™ High Density Backplane Connectors

TE Connectivity's IMPACT™ Connector System meets the increased speed and density requirements of future system upgrades and next generation data networking and telecommunications equipment. TE's IMPACT High Density Backplane Connectors feature unique broad-edge coupled design which utilizes low impedance and a localized ground return path in an optimized differential pair array. The differential pairs are tightly coupled at 80 pairs per linear inch, and are surrounded by ground structures to isolate the pairs. This innovative design enables the IMPACT High Density Backplane Connectors to achieve data rates up to 25Gb/s, reduce crosstalk, and improve overall bandwidth performance with minimal performance variance. The IMPACT High Density Backplane Connectors offered by TE are ideally suited for high speed, backplane applications such as switches, servers/blade servers, storage, and routers.