LMG2656RFBR

Texas Instruments
595-LMG2656RFBR
LMG2656RFBR

Mfr.:

Description:
Gate Drivers 650V 230mohm GaN ha lf-bridge with integ

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 1.600

Stock:
1.600 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (IDR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
Rp205.292 Rp205.292
Rp151.355 Rp1.513.550
Rp145.484 Rp3.637.100
Rp123.285 Rp12.328.500
Rp121.084 Rp30.271.000
Rp119.616 Rp59.808.000
Rp118.148 Rp118.148.000
Full Reel (Order in multiples of 2000)
Rp100.536 Rp201.072.000
† A MouseReel™ fee of Rp98.000 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Gate Drivers
RoHS:  
Half-Bridge
SMD/SMT
VQFN-19
10 V
26 V
- 40 C
+ 125 C
LMG2656
Reel
Cut Tape
MouseReel
Brand: Texas Instruments
Development Kit: LMG2656EVM-102
Input Voltage - Max: 26 V
Maximum Turn-On Delay Time: 150 ns
Moisture Sensitive: Yes
Product Type: Gate Drivers
Rds On - Drain-Source Resistance: 230 mOhms
Shutdown: No Shutdown
Factory Pack Quantity: 2000
Subcategory: PMIC - Power Management ICs
Technology: GaN
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Compliance Codes
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99
Origin Classifications
Country of Origin:
Philippines
Assembly Country of Origin:
Philippines
Country of Diffusion:
Japan
The country is subject to change at the time of shipment.

LMG2656 650V GaN Power-FET Half Bridge

Texas Instruments LMG2656 650V GaN Power-FET Half Bridge simplifies design, reduces component count, and reduces board space by integrating half-bridge power FETs, gate drivers, bootstrap FET, and high-side gate-drive level shifter in a 6mm by 8mm QFN package. Programmable turn-on slew rates provide EMI and ringing control. The low-side current-sense emulation reduces power dissipation compared to the traditional current-sense resistor and allows the low-side thermal pad to be connected to PCB power ground.