TPSM5601R5HRDAR

Texas Instruments
595-TPSM5601R5HRDAR
TPSM5601R5HRDAR

Mfr.:

Description:
Switching Voltage Regulators 60-V input 1-V to 1 6-V output 1.5-A po

ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
490
Expected 27/08/2026
32.000
Expected 14/12/2026
Factory Lead Time:
18
Weeks Estimated factory production time for quantities greater than shown.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 1000)

Pricing (IDR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
Rp160.344 Rp160.344
Rp124.569 Rp1.245.690
Rp115.580 Rp2.889.500
Rp105.673 Rp10.567.300
Rp102.187 Rp25.546.750
Rp100.720 Rp50.360.000
Full Reel (Order in multiples of 1000)
Rp95.583 Rp95.583.000
† A MouseReel™ fee of Rp98.000 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Switching Voltage Regulators
RoHS:  
1 V to 16 V
1.5 A
4.2 V
60 V
1 MHz
- 40 C
+ 125 C
TPSM5601R5H
Reel
Cut Tape
MouseReel
Brand: Texas Instruments
Load Regulation: 0.057 %
Moisture Sensitive: Yes
Product Type: Switching Voltage Regulators
Factory Pack Quantity: 1000
Subcategory: PMIC - Power Management ICs
Tradename: HotRod
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Compliance Codes
CNHTS:
8542399000
CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
China
Country of Diffusion:
United States
The country is subject to change at the time of shipment.

TPSM5601R5Hx 1.5A Power Module

Texas Instruments TPSM5601R5Hx 1.5A Power Module is a highly integrated power solution that combines a 60V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5mm × 5.5mm × 4mm, 15-pin QFN package uses Enhanced HotRod QFN technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.