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OMNI-220C

Name: Wakefield Thermal OMNI-220C
Brand: Wakefield Thermal
SKU: 567-OMNI-220C
Price: 31188 IDR
Availability: OutOfStock

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See Product Specifications

Mouser No:

567-OMNI-220C

Mfr. No:

OMNI-220C

Mfr.:

Wakefield Thermal

Description:

Heat Sinks Clip for omniKlip Heat Sinks for TO-220

Datasheet:

OMNI-220C Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Wakefield Thermal OMNI-220C

Availability

Stock:: 0

You can still purchase this product for backorder.

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On Order:: 718

Expected 09/03/2026

3.000

1.000

Expected 29/05/2026

2.000

Expected 10/06/2026
Factory Lead Time:: 21

Weeks Estimated factory production time for quantities greater than shown.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp31.188	Rp31.188
	Rp28.620	Rp286.200
	Rp27.702	Rp692.550
	Rp27.519	Rp1.375.950
	Rp27.336	Rp2.733.600
	Rp23.483	Rp5.870.750
	Rp22.199	Rp11.099.500
	Rp21.098	Rp21.098.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Wakefield Thermal
Product Category:	Heat Sinks
RoHS:
Product:	Accessories and Hardware
Designed for:	TO-220
Mounting Style:	Clip
Heatsink Material:	Aluminum
Brand:	Wakefield Thermal
Product Type:	Heat Sinks
Series:	OMNI
Factory Pack Quantity:	1000
Subcategory:	Heat Sinks
Tradename:	omniKlip
Type:	Component
Unit Weight:	3,244 g

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Datasheet

OMNI-220C Datasheet (PDF)

RoHS Certificate (PDF)

CNHTS:: 8548000090
USHTS:: 7326908688
TARIC:: 8473308000
BRHTS:: 73269090
ECCN:: EAR99

omniKlip™ Heat Sinks with Clips

Wakefield Thermal omniKlip™ Heat Sinks with Clips are a configurable, high-performance, cost-effective, and compact solution for TO-220, TO-247, TO-264, and similar packages. The powerful heat sink provides a tool and fixture-free assembly operation, large surface areas, and small space occupation. Spring clips make the mounting holes and fasteners unnecessary while reducing costs and assembly time. Wakefield Thermal omniKlip Heat Sinks are ideal for applications requiring high power density and small size (1U or 2U) with forced convection cooling.