conga-HPC/mRLP-HSP-B
787-049254
conga-HPC/mRLP-HSP-B
Mfr.:
Description:
Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
Availability
-
Stock:
-
0An unexpected error occurred. Please try again later.
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On Order:
-
2Expected 08/07/2026
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Factory Lead Time:
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14Weeks Estimated factory production time for quantities greater than shown.
Pricing (IDR)
| Qty. | Unit Price |
Ext. Price
|
|---|---|---|
| Rp920.419 | Rp920.419 | |
| Rp870.334 | Rp8.703.340 | |
| Rp826.304 | Rp20.657.600 | |
| Rp782.090 | Rp39.104.500 | |
| Rp760.258 | Rp76.025.800 | |
| Rp759.891 | Rp189.972.750 | |
| 500 | Quote |
Datasheet
Compliance Codes
- USHTS:
- 8473305100
- MXHTS:
- 8473300002
- ECCN:
- EAR99
Origin Classifications
- Country of Origin:
- China
- Assembly Country of Origin:
- Not available
- Country of Diffusion:
- Not available
Indonesia
