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110110192

Name: Seeed Studio 110110192
Brand: Seeed Studio
SKU: 713-110110192
Price: 14658454 IDR
Availability: InStock

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Mouser No:

713-110110192

Mfr. No:

110110192

Mfr.:

Seeed Studio

Description:

Industrial Box PCs reComputer Industrial J3010- Fanless Edge AI Device with Jetson Orin Nano 4GB module, Aluminum case with passive cooling, 2xRJ45 GbE, 1xRS232/RS-422/RS-485, 4xDI/DO, 1xCAN, 3xUSB3.2, Pre-installed JetPack System

Datasheet:

110110192 Datasheet (PDF)

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Learn more about Seeed Studio 110110192

In Stock: 3

Stock:: 3 Can Dispatch Immediately

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Factory Lead Time:: 4 Weeks Estimated factory production time for quantities greater than shown.

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Qty.	Unit Price	Ext. Price
	Rp14.658.454	Rp14.658.454

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Seeed Studio
Product Category:	Industrial Box PCs
RoHS:
Processor Type:	ARM Cortex A78
Memory Type:	LPDDR5
Dimensions:	159 mm x 155 mm x 57 mm
Maximum Operating Temperature:	+ 60 C
Minimum Operating Temperature:	- 20 C
Brand:	Seeed Studio
Processor Brand:	NVIDIA
Product Type:	Industrial PCs
Factory Pack Quantity:	1
Subcategory:	Computing

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Datasheet

110110192 Datasheet (PDF)

CAHTS:: 8471500090
USHTS:: 8471500150
JPHTS:: 847150000
TARIC:: 8471500000
MXHTS:: 8471500100
ECCN:: 5A992.C

reComputer Industrial Fanless Edge AI Devices

Seeed Studio reComputer Industrial Fanless Edge AI Devices offer full systems, including NVIDIA^® Jetson Xavier NX/Orin Nano/Orin NX modules. These devices combine the NVIDIA Ampere™ GPU architecture and 64-bit operating capability to provide 20 TOPS to 100 TOPS AI performance. The reComputer industrial edge AI devices come with pre-installed Jetpack 5.1 SDK, which includes NVIDIA technologies and CUDA-X accelerated libraries. These devices feature a passive heatsink and a fanless design. The fanless design with versatile mounting options enables deployment within a -20°C to 60°C temperature range, which is ideal for harsh environments and heavy loads. The passive heatsink enables efficient cooling without a fan and reduces the risk of component failure due to dust or other contaminants.