It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

Return to Search Results

See an Error?

CLA-T264-21

Images are for reference only
See Product Specifications

Mouser No:

588-CLA-T264-21

Mfr. No:

CLA-T264-21

Mfr.:

Ohmite

Description:

Heat Sinks CAMMING CLIP FOR TO-264

Lifecycle:

Factory Special Order:

Obtain a quote to verify the current price, lead-time and ordering requirements of the manufacturer.

Datasheet:

CLA-T264-21 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Ohmite CLA-T264-21

Availability

Stock:: Not Available

An unexpected error occurred. Please try again later.

Pricing (IDR)

Request a Quote

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Ohmite
Product Category:	Heat Sinks
RoHS:
Product:	Accessories and Hardware
Designed for:	TO-264
Mounting Style:	Clip
Length:	20.2 mm
Width:	11 mm
Height:	35.3 mm
Brand:	Ohmite
Color:	Silver
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	CLA-21E
Factory Pack Quantity:	10
Subcategory:	Heat Sinks
Type:	Component
Unit Weight:	71 g

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

CLA-T264-21 Datasheet (PDF)

CNHTS:: 7616991090
USHTS:: 8541900080
TARIC:: 8517700000
ECCN:: EAR99

C40 Heat Sink System

Ohmite C40 Series Heat Sink System offers flexible, high performance, and compact heat sinks with an exchangeable cam clip system for TO-247, TO-264, and SOT-227 (clip in development) devices. This powerful heat sink can be thru-hole soldered in single or paired configurations. The paired unit has mounting holes to accommodate a 40mm x 40mm fan. Ideal applications for Ohmite C40 Series Heat Sink System include high power density and small size (1U or 2U) electronic packaging with forced convection.

Heatsinks

Ohmite Heatsinks are engineered to take advantage of thermal transfer, reliability, and design flexibility. This heat sink product line utilizes a patented clip system that provides constant spring force over repeated assembly and disassembly. The elimination of mounting hardware reduces costs and enables a maximum surface area per unit design. Ohmite Heatsinks are designed to secure TO-126, TO-218, TO-220, TO-247, and TO-264 packages as well as provide thermal solutions for TO-252, TO-263, and TO-268 SMD devices.