CLA-T264-21E

Ohmite
588-CLA-T264-21E
CLA-T264-21E

Mfr.:

Description:
Heat Sinks CLIP FOR TO-264

Datasheet:
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Learn more about Ohmite CLA-T264-21E

In Stock: 5.148

Stock:
5.148 Can Dispatch Immediately
Factory Lead Time:
23 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp39.627 Rp39.627
Rp35.775 Rp357.750
Rp34.857 Rp871.425
Rp32.839 Rp1.641.950
Rp31.005 Rp3.100.500
Rp29.537 Rp7.384.250
Rp28.253 Rp14.126.500
Rp26.051 Rp26.051.000
Rp24.767 Rp123.835.000

Product Attribute Attribute Value Select Attribute
Ohmite
Product Category: Heat Sinks
RoHS:  
Accessories and Hardware
TO-264
Clip
35.3 mm
20.2 mm
11 mm
Brand: Ohmite
Packaging: Bulk
Product Type: Heat Sinks
Series: CLA-21E
Factory Pack Quantity: 5000
Subcategory: Heat Sinks
Type: Component
Unit Weight: 71 g
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Attributes selected: 0

Datasheet

Application Notes

CNHTS:
8548000090
USHTS:
8541900080
TARIC:
7326909890
ECCN:
EAR99

Heatsinks

Ohmite Heatsinks are engineered to take advantage of thermal transfer, reliability, and design flexibility. This heat sink product line utilizes a patented clip system that provides constant spring force over repeated assembly and disassembly. The elimination of mounting hardware reduces costs and enables a maximum surface area per unit design. Ohmite Heatsinks are designed to secure TO-126, TO-218, TO-220, TO-247, and TO-264 packages as well as provide thermal solutions for TO-252, TO-263, and TO-268 SMD devices.

C40 Heat Sink System

Ohmite C40 Series Heat Sink System offers flexible, high performance, and compact heat sinks with an exchangeable cam clip system for TO-247, TO-264, and SOT-227 (clip in development) devices. This powerful heat sink can be thru-hole soldered in single or paired configurations. The paired unit has mounting holes to accommodate a 40mm x 40mm fan. Ideal applications for Ohmite C40 Series Heat Sink System include high power density and small size (1U or 2U) electronic packaging with forced convection.

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