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DD100N16S

Name: Infineon DD100N16S
Brand: Infineon Technologies
SKU: 641-DD100N16S
Price: 567809 IDR
Availability: OutOfStock

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See Product Specifications

Mouser No:

641-DD100N16S

Mfr. No:

DD100N16S

Mfr.:

Infineon Technologies

Description:

Diode Modules 20mm Solder Bond Rectifier Diode

Datasheet:

DD100N16S Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Infineon Technologies DD100N16S

Availability

Stock:: 0

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On Order:: 228

Expected 26/02/2026

204

Expected 05/03/2026
Factory Lead Time:: 30

Weeks Estimated factory production time for quantities greater than shown.

Long lead time reported on this product.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp567.809	Rp567.809
	Rp474.428	Rp5.693.136
	Rp414.803	Rp44.798.724

Alternative Packaging

Mfr. Part No.:

DD100N16SHPSA1

Packaging:

Tray

Availability:

In Stock

Price:

Rp545.060

Min:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Diode Modules
RoHS:
Mounting Style:	Screw Mount
Vr - Reverse Voltage:	1.6 kV
Configuration:	Single
Vf - Forward Voltage:	1.6 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tray
Brand:	Infineon Technologies
Product Type:	Diode Modules
Factory Pack Quantity:	12
Subcategory:	Discrete and Power Modules
Technology:	Si
Part # Aliases:	SP001272774 DD100N16SHPSA1
Unit Weight:	75 g

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Datasheet

DD100N16S Datasheet (PDF)

Product Catalogs

Infineon's Latest Power and Sensing Guide (PDF)

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CNHTS:: 8542399000
CAHTS:: 8541100090
USHTS:: 8541100080
JPHTS:: 854110090
KRHTS:: 8541109000
TARIC:: 8541100000
MXHTS:: 8541100101
ECCN:: EAR99

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.