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DZ02B008DC1

Name: JAE Electronics DZ02B008DC1
Brand: JAE Electronics
SKU: 656-DZ02B008DC1
Price: 55405 IDR
Availability: OutOfStock

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Mouser No:

656-DZ02B008DC1

Mfr. No:

DZ02B008DC1

Mfr.:

JAE Electronics

Description:

I/O Connectors Mini I/O Industrial Plug 0.635mm pitch

Datasheet:

DZ02B008DC1 Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 27 Weeks Estimated factory production time.

Long lead time reported on this product.

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Minimum: 2000 Multiples: 2000

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp55.405	Rp110.810.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	JAE Electronics
Product Category:	I/O Connectors
RoHS:
Product:	Interface Connectors
Gender:	Male
Number of Positions:	8 Position
Pitch:	0.635 mm
Voltage Rating:	30 V
Contact Plating:	Gold
Mounting Style:	Cable Mount
Termination Style:	Crimp
Mounting Angle:	Straight
Series:	DZ02
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Tray
Brand:	JAE Electronics
Contact Material:	Copper Alloy
Current Rating:	500 mA
Features:	Lock structure with superior vibration resistance
Housing Material:	Resin
Insulation Material:	Synthethic Resin
Insulation Resistance:	500 MOhms
Number of Ports:	1 Port
Product Type:	I/O Connectors
Factory Pack Quantity:	2000
Subcategory:	I/O Connectors
Type:	Mini I/O Connector

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Datasheet

DZ02B008DC1 Datasheet (PDF)

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CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
TARIC:: 8536699099
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

DZ02 Mini I/O Connectors

JAE Electronics DZ02 Mini I/O Connector is a 0.635mm pitch compact connector with a superior lock structure resistant to vibration and is suitable for use under harsh environmental conditions. The DZ02 Series can be used as an I/O connector for systems compatible with the product standard IEC/EN 61800-5-2 (Electrical Control Motor) of the international standard IEC 61508 for functional safety. The connector has good operability and secures uniformity (coplanarity) of the lowest surface of each terminal against the mounting surface to improve SMT mount ability.