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FS01MR08A8MA2LBCHPSA1

Name: Infineon FS01MR08A8MA2LBCHPSA1
Brand: Infineon Technologies
SKU: 726-FS01MR08A8MA2LBC
Price: 17483738 IDR
Availability: InStock

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Mouser No:

726-FS01MR08A8MA2LBC

Mfr. No:

FS01MR08A8MA2LBCHPSA1

Mfr.:

Infineon Technologies

Description:

Discrete Semiconductor Modules HYBRID PACK DRIVE G2 SIC

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

FS01MR08A8MA2LBCHPSA1 Datasheet (PDF)

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In Stock: 11

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Factory Lead Time:: 39 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp17.483.738	Rp17.483.738

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Discrete Semiconductor Modules
RoHS:
Technology:	SiC
Series:	G2
Packaging:	Tray
Brand:	Infineon Technologies
Product Type:	Discrete Semiconductor Modules
Factory Pack Quantity:	6
Subcategory:	Discrete Semiconductor Modules
Tradename:	HybridPACK
Part # Aliases:	FS01MR08A8MA2LBC SP005567339

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Datasheet

FS01MR08A8MA2LBCHPSA1 Datasheet (PDF)

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CAHTS:: 8541290000
USHTS:: 8541290065
JPHTS:: 854129000
TARIC:: 8541290000
MXHTS:: 8541299900
ECCN:: EAR99

HybridPACK™ Drive G2 Modules

Infineon Technologies HybridPACK™ Drive G2 Modules are compact power modules designed for hybrid and electric vehicle traction. The Infineon Technologies G2 modules offer scalable performance levels using Si or SiC technologies and different chipsets, maintaining the same module size. Introduced in 2017 with silicon EDT2 technology, it was optimized for efficiency in real-world driving. In 2021, a CoolSiC™ version was introduced, offering higher cell density and better performance. In 2023, the second generation, HybridPACK Drive G2, was launched with EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET technologies, providing ease of use and integration options for sensors, enabling up to 300kW performance within 750V and 1200V classes.