HSB32-232318

Same Sky
179-HSB32-232318
HSB32-232318

Mfr.:

Description:
Heat Sinks heat sink, BGA, 23 x 23 x 18 mm, channel

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 594

Stock:
594 Can Dispatch Immediately
Factory Lead Time:
14 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp24.951 Rp24.951
Rp22.015 Rp220.150
Rp21.098 Rp527.450
Rp20.364 Rp1.018.200
Rp19.630 Rp1.963.000
Rp18.713 Rp4.678.250
Rp17.575 Rp8.787.500
Rp16.915 Rp11.908.160
Rp15.704 Rp44.222.464

Product Attribute Attribute Value Select Attribute
Same Sky
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
PCB
Aluminum Alloy
17.2 C/W
23 mm
23 mm
18 mm
Brand: Same Sky
Color: Black
Product Type: Heat Sinks
Factory Pack Quantity: 704
Subcategory: Heat Sinks
Type: BGA Heat Sink
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Attributes selected: 0

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USHTS:
8473305100
ECCN:
EAR99

BGA Heat Sinks

Same Sky BGA Heat Sinks are ideal for ball grid array (BGA) devices and are measured under four conditions for thermal resistance. These heat sinks carry power dissipation ratings from 1.92W up to 21.74W at +75°C. Made from aluminum or copper with a black anodized or clean finish, the HSB series supports a wide range of sizes, from 8.5mm x 8.5mm to 69.7mm x 69.7mm, with 5mm to 25mm profiles. As adhesive or PCB mountable devices, Same Sky BGA Heat Sinks are essentially simple extrusions where the extruded fins have been crosscut into pins, making them suitable for BGA applications.