|
|
System-On-Modules - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - -40 C to 85 C
- OSD3358-512M-ICB
- Octavo Systems
-
1:
Rp1.226.063
-
374In Stock
|
Mouser Part No
415-OSD3358-512M-ICB
|
Octavo Systems
|
System-On-Modules - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - -40 C to 85 C
|
|
374In Stock
|
|
|
Rp1.226.063
|
|
|
Rp1.151.945
|
|
|
Rp1.032.880
|
|
|
Rp1.032.696
|
|
|
View
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
Development Boards & Kits - ARM Reference, Evaluation, Development board for the OSD32MP15x Family of System-in-Package Devices
- OSD32MP1-RED
- Octavo Systems
-
1:
Rp5.040.564
-
18In Stock
|
Mouser Part No
415-OSD32MP1-RED
|
Octavo Systems
|
Development Boards & Kits - ARM Reference, Evaluation, Development board for the OSD32MP15x Family of System-in-Package Devices
|
|
18In Stock
|
|
|
Rp5.040.564
|
|
|
Rp4.988.094
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - 0 C to 85 C
- OSD3358-512M-BCB
- Octavo Systems
-
1:
Rp1.180.565
-
130In Stock
|
Mouser Part No
415-OSD3358-512M-BCB
|
Octavo Systems
|
System-On-Modules - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - 0 C to 85 C
|
|
130In Stock
|
|
|
Rp1.180.565
|
|
|
Rp1.109.199
|
|
|
Rp1.109.016
|
|
|
Rp994.720
|
|
|
View
|
|
|
Rp984.079
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: Texas Instruments AM6254 ARM Quad Cortex A53 Processor, 1GB DDR4, Passives - 9mm X 14mm 500 Ball BGA - -40C to 85C
- OSD6254-1G-IPM
- Octavo Systems
-
1:
Rp652.751
-
128In Stock
-
New Product
|
Mouser Part No
415-OSD6254-1G-IPM
New Product
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: Texas Instruments AM6254 ARM Quad Cortex A53 Processor, 1GB DDR4, Passives - 9mm X 14mm 500 Ball BGA - -40C to 85C
|
|
128In Stock
|
|
|
Rp652.751
|
|
|
Rp613.307
|
|
|
Rp593.860
|
|
|
Rp575.147
|
|
|
View
|
|
|
Rp550.013
|
|
|
Rp532.401
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
Development Boards & Kits - ARM Flexible Prototyping Platform for the OSD62x-PM System in Package
- OSD62-PM-BRK
- Octavo Systems
-
1:
Rp2.066.677
-
7In Stock
-
4Expected 27/02/2026
-
New Product
|
Mouser Part No
415-OSD62-PM-BRK
New Product
|
Octavo Systems
|
Development Boards & Kits - ARM Flexible Prototyping Platform for the OSD62x-PM System in Package
|
|
7In Stock
4Expected 27/02/2026
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
Development Boards & Kits - ARM Reference, Evaluation, and Development Platform for the OSDZU3 System-in-Package
- OSDZU3-REF
- Octavo Systems
-
1:
Rp22.889.570
-
7In Stock
-
New At Mouser
|
Mouser Part No
415-OSDZU3-REF
New At Mouser
|
Octavo Systems
|
Development Boards & Kits - ARM Reference, Evaluation, and Development Platform for the OSDZU3 System-in-Package
|
|
7In Stock
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 100C
- OSDZU3EG1-2G-HFB
- Octavo Systems
-
1:
Rp13.771.425
-
10In Stock
-
New At Mouser
|
Mouser Part No
415-OSDZU3EG1-2G-HFB
New At Mouser
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 100C
|
|
10In Stock
|
|
|
Rp13.771.425
|
|
|
Rp13.313.325
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 1GBB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
- OSD3358-1G-ISM
- Octavo Systems
-
1:
Rp1.210.653
-
363In Stock
|
Mouser Part No
415-OSD3358-1G-ISM
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 1GBB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
|
|
363In Stock
|
|
|
Rp1.210.653
|
|
|
Rp1.137.635
|
|
|
Rp1.020.221
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
Development Boards & Kits - ARM OSD335x-SM RED Eval Board
- OSD3358-SM-RED
- Octavo Systems
-
1:
Rp6.420.917
-
11In Stock
|
Mouser Part No
415-OSD3358-SM-RED
|
Octavo Systems
|
Development Boards & Kits - ARM OSD335x-SM RED Eval Board
|
|
11In Stock
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
- OSD32MP157C-512M-BAA
- Octavo Systems
-
1:
Rp938.398
-
81In Stock
-
168Expected 15/05/2026
|
Mouser Part No
415-O32MP157C512MBAA
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
|
|
81In Stock
168Expected 15/05/2026
|
|
|
Rp938.398
|
|
|
Rp881.709
|
|
|
Rp870.701
|
|
|
Rp854.557
|
|
|
View
|
|
|
Rp788.511
|
|
|
Rp788.328
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C
- OSD32MP157C-512M-IAA
- Octavo Systems
-
1:
Rp968.669
-
236In Stock
|
Mouser Part No
415-O32MP157C512MIAA
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C
|
|
236In Stock
|
|
|
Rp968.669
|
|
|
Rp968.485
|
|
|
Rp816.214
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
Development Boards & Kits - ARM Flexible Prototyping Platform for the OSD32MP1 System in Package
- OSD32MP1-BRK
- Octavo Systems
-
1:
Rp1.334.121
-
10In Stock
|
Mouser Part No
415-OSD32MP1-BRK
|
Octavo Systems
|
Development Boards & Kits - ARM Flexible Prototyping Platform for the OSD32MP1 System in Package
|
|
10In Stock
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM AM3358 512MB DDR3 System-In-Package
- OSD3358-512M-BSM
- Octavo Systems
-
1:
Rp785.209
-
420On Order
|
Mouser Part No
415-OSD3358-512M-BSM
|
Octavo Systems
|
System-On-Modules - SOM AM3358 512MB DDR3 System-In-Package
|
|
420On Order
On Order:
180 Expected 20/02/2026
120 Expected 20/03/2026
120 Expected 06/05/2026
Factory Lead Time:
18 Weeks
|
|
|
Rp785.209
|
|
|
Rp737.693
|
|
|
Rp661.557
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
- OSD3358-512M-ISM
- Octavo Systems
-
1:
Rp832.908
-
1.500On Order
|
Mouser Part No
415-OSD3358-512M-ISM
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
|
|
1.500On Order
On Order:
600 Expected 05/06/2026
900 Expected 10/06/2026
Factory Lead Time:
18 Weeks
|
|
|
Rp832.908
|
|
|
Rp782.457
|
|
|
Rp701.735
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 0C to 85C
- OSDZU3EG1-2G-BFA
- Octavo Systems
-
1:
Rp13.417.714
-
6Expected 20/02/2026
-
New At Mouser
|
Mouser Part No
415-OSDZU3EG1-2G-BFA
New At Mouser
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 0C to 85C
|
|
6Expected 20/02/2026
|
|
|
Rp13.417.714
|
|
|
Rp13.361.942
|
|
|
View
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C
- OSDZU3EG1-2G-IFA
- Octavo Systems
-
1:
Rp13.228.016
-
3Expected 16/02/2026
-
New At Mouser
|
Mouser Part No
415-OSDZU3EG1-2G-IFA
New At Mouser
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C
|
|
3Expected 16/02/2026
|
|
|
Rp13.228.016
|
|
|
Rp12.454.916
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C
- OSDZU3EG1-2G-IFB
- Octavo Systems
-
1:
Rp13.228.016
-
3Expected 20/04/2026
-
New At Mouser
|
Mouser Part No
415-OSDZU3EG1-2G-IFB
New At Mouser
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C
|
|
3Expected 20/04/2026
|
|
|
Rp13.228.016
|
|
|
Rp12.454.916
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 20 C to 85 C
- OSD32MP157F-512M-EAA
- Octavo Systems
-
1:
Rp1.039.301
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
415-O32MP157F512MEAA
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 20 C to 85 C
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
|
Rp1.039.301
|
|
|
Rp1.006.462
|
|
|
Rp1.006.278
|
|
|
Rp938.581
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C
- OSD32MP153C-512M-IAA
- Octavo Systems
-
1:
Rp976.191
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
415-OS2MP153C512MIAA
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
|
Rp976.191
|
|
|
Rp929.408
|
|
|
Rp881.709
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
- OSD32MP153C-512M-BAA
- Octavo Systems
-
1:
Rp937.664
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
415-OSD32153C512MBAA
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
|
Rp937.664
|
|
|
Rp860.244
|
|
|
Rp859.877
|
|
|
Rp846.118
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
- OSD32MP157F-512M-BAA
- Octavo Systems
-
84:
Rp910.145
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
415-OSD32157F512MBAA
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 84
Mult.: 84
|
|
|
|
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 0C to 85C
- OSDZU3EG1-2G-BFB
- Octavo Systems
-
6:
Rp13.418.815
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
415-OSDZU3EG1-2G-BFB
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 0C to 85C
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
|
Rp13.418.815
|
|
|
Rp13.275.166
|
|
|
View
|
|
|
Quote
|
|
Min.: 6
Mult.: 6
|
|
|
|
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 100C
- OSDZU3EG1-2G-HFA
- Octavo Systems
-
1:
Rp14.021.664
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
415-OSDZU3EG1-2G-HFA
|
Octavo Systems
|
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 100C
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
|
Rp14.021.664
|
|
|
Rp13.750.327
|
|
|
View
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
System-On-Modules - SOM AM3358 512MB DDR3 System-In-Package
- OSD3358-512M-IND
- Octavo Systems
-
Non-Stocked Lead-Time 28 Weeks
-
Factory Special Order
|
Mouser Part No
415-OSD3358-512M-IND
Factory Special Order
|
Octavo Systems
|
System-On-Modules - SOM AM3358 512MB DDR3 System-In-Package
|
|
Non-Stocked Lead-Time 28 Weeks
|
|
|
|
|
Indonesia
