BM2SC125FP2-LBZE2

ROHM Semiconductor
755-BM2SC125FP2LBZE2
BM2SC125FP2-LBZE2

Mfr.:

Description:
AC/DC Converters Quasi-resonant AC/DC Converter Built-in 1700V SiC-MOSFET

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 450

Stock:
450 Can Dispatch Immediately
Factory Lead Time:
22 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp235.379 Rp235.379
Rp191.349 Rp1.913.490
Rp182.359 Rp4.558.975
Rp158.326 Rp15.832.600
Rp151.355 Rp37.838.750
Full Reel (Order in multiples of 500)
Rp126.404 Rp63.202.000
Rp117.414 Rp117.414.000

Product Attribute Attribute Value Select Attribute
ROHM Semiconductor
Product Category: AC/DC Converters
SMD/SMT
TO-263-7
15 V
27.5 V
SiC
120 kHz
800 uA
- 40 C
+ 105 C
Reel
Cut Tape
Brand: ROHM Semiconductor
Isolation: Isolated
Number of Outputs: 1 Output
Product: AC/DC Converters
Product Type: AC/DC Converters
Factory Pack Quantity: 500
Subcategory: PMIC - Power Management ICs
Type: Quasi-Resonant AC/DC Converter
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USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

BM2SC125FP2-LBZ Quasi-Resonant AC/DC Converter

ROHM Semiconductor BM2SC125FP2-LBZ Quasi-Resonant AC/DC Converter is a high-efficiency IC that integrates a 1700V Silicon Carbide (SiC) MOSFET, making it ideal for high-voltage, isolated power supply applications. Designed to operate directly from the AC line, this device is optimized for use in home appliances, industrial equipment, and energy infrastructure systems where compact size, low power loss, and long-term reliability are essential. The quasi-resonant switching topology reduces switching noise and improves efficiency, while built-in features such as soft-start, frequency hopping, and comprehensive protection circuits (including overcurrent, overvoltage, overload, and thermal shutdown) ensure safe and stable operation. Housed in a compact TO-263-7L package, the ROHM Semiconductor BM2SC125FP2-LBZ simplifies power supply design by minimizing external components and enabling high-density layouts, making it a robust solution for next-generation power electronics.