CYW20736ET

Infineon Technologies
727-CYW20736ET
CYW20736ET

Mfr.:

Description:
RF Microcontrollers - MCU Bluetooth BLE and IEEE 802.15.4

Lifecycle:
NRND:
Not recommended for new designs.
Datasheet:
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Learn more about Infineon Technologies CYW20736ET

Availability

Stock:
Non-Stocked
Factory Lead Time:
14 Weeks Estimated factory production time.
Minimum: 2500   Multiples: 2500
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Full Reel (Order in multiples of 2500)
Rp243.268 Rp608.170.000

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: RF Microcontrollers - MCU
RoHS:  
Reel
Brand: Infineon Technologies
Moisture Sensitive: Yes
Product Type: RF Microcontrollers - MCU
Series: CYW20736
Factory Pack Quantity: 2500
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
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Attributes selected: 0

Datasheet

CNHTS:
8542310000
CAHTS:
8542310000
USHTS:
8542310030
MXHTS:
8542310302
ECCN:
5A992.C

CYW20736 BLUETOOTH® Low Energy SoC

Infineon Technologies CYW20736 BLUETOOTH® Low Energy SoC features a 200nA power-down current, 3.63V input signal range, and 2402MHz to 2480MHz frequency range. The CYW20736 supports the entire spectrum of Bluetooth Smart use cases for medical, home automation, accessory, sensor, Internet of Things (IoT), and wearable market segments. The CYW20736 Bluetooth Low Energy SoC is a monolithic component implemented in a standard digital CMOS process and requires minimal external components to make a fully compliant Bluetooth device. The Infineon CYW20736 is available in a 32-pin, 5mm × 5mm 32-QFN package and WLCSP and die packages.

AIROC™ BLUETOOTH® & BLUETOOTH LE SoCs

Infineon Technologies AIROC™ BLUETOOTH® and BLUETOOTH LE SoCs enable the capability to compute at the edge for various IoT applications. The devices feature integrated flash with analog and digital components, allowing for easy interfacing with external components.

CYW207xx RF System on a Chip

Infineon Technologies CYW207xx RF Systems on a Chip provides a high level of integration for wearables and other consumer/industrial embedded applications. The devices include integrated PMU, IEEE 802.11 MAC/baseband, radio, and BLUETOOTH® for each combo chip. The chips support all rates specified in the IEEE 802.11a/b/g/n/ac specifications. The CYW207xx also supports optional antenna diversity for improved RF performance in difficult environments.

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