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DF419MR20W3M1HFB11BPSA1

Name: Infineon DF419MR20W3M1HFB11BPSA1
Brand: Infineon Technologies
SKU: 726-419MR20W3M1HFB11
Price: 4290579 IDR
Availability: InStock

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Mouser No:

726-419MR20W3M1HFB11

Mfr. No:

DF419MR20W3M1HFB11BPSA1

Mfr.:

Infineon Technologies

Description:

Discrete Semiconductor Modules 2000 V, 60 A Boost EasyPACK 3B CoolSiC MOSFET Module

Datasheet:

DF419MR20W3M1HFB11BPSA1 Datasheet (PDF)

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Learn more about Infineon Technologies DF419MR20W3M1HFB11BPSA1

In Stock: 10

Stock:: 10 Can Dispatch Immediately

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Factory Lead Time:: 10 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp4.290.579	Rp4.290.579
104	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Discrete Semiconductor Modules
RoHS:
Technology:	Si
Series:	DF419MR20W3M1HFB11
Packaging:	Tray
Brand:	Infineon Technologies
Product Type:	Discrete Semiconductor Modules
Factory Pack Quantity:	8
Subcategory:	Discrete Semiconductor Modules
Tradename:	EasyPACK
Part # Aliases:	DF4-19MR20W3M1HF_B11 SP005677961

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Datasheet

DF419MR20W3M1HFB11BPSA1 Datasheet (PDF)

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CNHTS:: 8504409100
CAHTS:: 8541210000
USHTS:: 8541210095
TARIC:: 8541210000
MXHTS:: 8541210100
ECCN:: EAR99

DF4-19MR20W3M1HF_B11 EasyPACK™ Module

Infineon Technologies DF4-19MR20W3M1HF_B11 EasyPACK™ Module is configured with the operation of the CoolSiC™ trench MOSFETs and PressFIT/NTC. The DF4-19MR20W3M1HF_B11 offers high current density and a low inductive design. The modules implement PressFIT contact technology and integrate an NTC temperature sensor.