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LBEE5WV2GF-001

Name: Murata LBEE5WV2GF-001
Brand: Murata Electronics
SKU: 81-LBEE5WV2GF-001
Price: 357747 IDR
Availability: InStock

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Mouser No:

81-LBEE5WV2GF-001

Mfr. No:

LBEE5WV2GF-001

Mfr.:

Murata Electronics

Description:

Multiprotocol Modules Type 2GF Shielded Small Wi-Fi 11a/b/g/n/ac Dual-band SISO + Bluetooth 5.4 Module

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

LBEE5WV2GF-001 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Murata Electronics LBEE5WV2GF-001

In Stock: 99

Stock:: 99 Can Dispatch Immediately

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Factory Lead Time:: 25 Weeks Estimated factory production time for quantities greater than shown.

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Unit Price:

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Ext. Price:

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp357.747	Rp357.747
Full Reel (Order in multiples of 1000)
	Rp357.747	Rp357.747.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Murata
Product Category:	Multiprotocol Modules
RoHS:
Series:	2GF
Frequency:	2.412 GHz to 5.825 GHz
Interface Type:	UART
Supply Voltage - Min:	3.2 V
Supply Voltage - Max:	4.6 V
Minimum Operating Temperature:	- 20 C
Maximum Operating Temperature:	+ 70 C
Antenna Connector Type:	7 Channel
Dimensions:	10 mm x 7.2 mm x 1.5 mm
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth 5.3
Protocol - WiFi - 802.11:	802.11 a/b/g/n/ac
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Murata Electronics
Features:	MAC/BD Address Are Embedded
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Number of Channels:	1 Channel
Operating Supply Voltage:	3.2 V to 4.6 V
Product:	Bluetooth
Product Type:	Multiprotocol Modules
Shielding:	Shielded
Factory Pack Quantity:	1000
Subcategory:	Wireless & RF Modules
Type:	WLAN Bluetooth Combo Module

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Datasheet

LBEE5WV2GF-001 Datasheet (PDF)

USHTS:: 8473301180
ECCN:: 5A992.C

Type 2GF W-LAN+BLUETOOTH® Combo Module

Murata Type 2GF W-LAN+BLUETOOTH^® Combo Module is a compact, high-performance module based on the Infineon CYW43022 combo chipset. This module supports Wi-Fi^® 802.11a/b/g/n/ac and Bluetooth 5.4 BR/EDR/LE, offering a PHY data rate of up to 78Mbps for Wi-Fi and 3Mbps for Bluetooth. The WLAN component is compatible with the SDIO v2.0 SDR25 interface, while the Bluetooth component features a high-speed 4-wire UART interface and PCM for audio-data transmission. The CYW43022 chipset incorporates advanced enhanced collaborative coexistence hardware mechanisms and algorithms designed to optimize the collaboration between WLAN and Bluetooth for maximum performance. This module is housed in a small-shielded form factor that facilitates integration into size- and power-sensitive applications such as IoT, gateways, and more.