NeXLev® High-Density Parallel B2B Connectors

Amphenol TCS NeXLev® High-Density Parallel B2B Connectors are capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance. The robust, damage-resistant design includes up to 57 real signals per linear centimeter (145 signals per linear inch), a ball grid array for precise alignment, a compliant BGA-style attachment to increase SMT process yields, and rugged wafer construction. The wafers can be routed to support either single-ended or differential-paired architectures.

Results: 34
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Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity.
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Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
20In Stock
Rp1.056.729,60
Rp1.021.321,82
Rp965.183,06
View
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 12.5 Gbps NeXLev Tray

Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Plug Solder Balls
Datasheet
20In Stock
Rp1.168.823,66
Rp1.129.930,14
Rp1.067.737,20
View
Min.: 20
Mult.: 20
Plugs 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
Non-Stocked Lead-Time 26 Weeks
Rp2.252.521,88
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 18 mm, 20 mm, 22 mm25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Rp335.915,26
Rp319.770,78
Rp309.130,10
Rp292.068,32
View
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
Non-Stocked Lead-Time 26 Weeks
Rp2.115.110,34
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Rp633.303,92
Rp612.939,86
Rp592.392,34
Rp559.919,92
View
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Rp840.980,64
Rp812.911,26
Rp768.330,48
Rp768.147,02
View
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
Non-Stocked
Rp760.074,78
Rp735.491,14
Rp710.907,50
Rp671.830,52
View
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Rp436.084,42
Rp415.169,98
Rp401.227,02
Rp379.028,36
View
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
Non-Stocked
Rp791.629,90
Rp766.128,96
Rp740.628,02
Rp699.716,44
Quote
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Bulk
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Rp791.629,90
Rp766.128,96
Rp740.628,02
Rp699.716,44
Quote
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Non-Stocked
Rp851.070,94
Rp822.634,64
Rp777.320,02
Rp777.136,56
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Rp895.835,18
Rp865.931,20
Rp818.415,06
Rp818.231,60
View
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 12.5 Gbps NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Non-Stocked
Rp1.102.778,06
Rp1.065.902,60
Rp1.007.562,32
View
Min.: 40
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Rp918.767,68
Rp888.129,86
Rp839.329,50
Rp839.146,04
Quote
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Non-Stocked
Rp1.003.893,12
Rp970.319,94
Rp916.933,08
View
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Non-Stocked
Rp1.102.594,60
Rp1.065.719,14
Rp1.007.378,86
View
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Rp1.102.594,60
Rp1.065.719,14
Rp1.007.378,86
View
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Non-Stocked
Rp1.148.459,60
Rp1.110.116,46
Rp1.049.207,74
View
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Rp1.419.613,48
Rp1.372.097,34
Rp1.297.062,20
View
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 12.5 Gbps NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls
Datasheet
Non-Stocked
Rp1.801.210,28
Rp1.702.141,88
View
Min.: 96
Mult.: 24
Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug Solder Balls
Datasheet
Non-Stocked
Rp555.700,34
Rp537.721,26
Rp519.742,18
Rp491.122,42
View
Min.: 24
Mult.: 24
Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls
Datasheet
Non-Stocked
Rp492.223,18
Rp476.445,62
Rp460.484,60
Rp434.983,66
View
Min.: 24
Mult.: 24
Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug Solder Balls
Datasheet
Non-Stocked
Rp903.173,58
Rp873.086,14
Rp825.019,62
Rp824.836,16
Quote
Min.: 24
Mult.: 24
Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls
Datasheet
Non-Stocked
Rp531.667,08
Rp514.421,84
Rp497.360,06
Rp469.841,06
View
Min.: 24
Mult.: 24
Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 14 mm, 17 mm, 22 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev