Thermal Bridge Technology for I/O Applications

TE Connectivity's (TE) Thermal Bridge Technology for Input/Output (I/O) Applications is a mechanical alternative to traditional gap pads or thermal interface materials. Thermal Bridge Technology offers superior thermal resistance while not completely relying on high levels of compression to achieve optimal thermal transfer. This technology features improved thermal resistance, better reliability and durability, and easier serviceability. TE Thermal Bridge Technology is ideal for 5G/wireless, servers, Ethernet SP routing, and high-performance computing (HPC) applications. 

Results: 5
Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Gender Number of Positions Pitch Contact Plating Mounting Style Termination Style Mounting Angle Minimum Operating Temperature Maximum Operating Temperature


TE Connectivity I/O Connectors CAGE ASSY,SFP-DD 1X1 THERMAL BRIDGE 446In Stock
Rp733.473
Rp623.397
Rp592.392
Rp573.313
Min.: 1
Mult.: 1
Cage Assemblies 40 Position Through Hole Press Fit Right Angle
TE Connectivity I/O Connectors SFP+ 1x1 Cage Assy Thermal Bridge 451In Stock
Rp828.505
Rp679.719
Rp647.063
Rp628.717
Min.: 1
Mult.: 1
Cage Assemblies Female 20 Position 14.25 mm Through Hole Press Fit Right Angle - 55 C + 85 C
TE Connectivity I/O Connectors CAGE ASSEMBLY QSFP28 1X1 THERMAL 241In Stock
53Expected 26/10/2026
Rp1.166.989
Rp962.064
Rp916.016
Rp890.331
Min.: 1
Mult.: 1
Cages Female 38 Position 19 mm Press Fit Solder Pin Straight - 40 C + 85 C
TE Connectivity I/O Connectors CAGE ASSEMBLY QSFP-DD 1X1, SPRING Non-Stocked Lead-Time 7 Weeks
Rp818.232
Min.: 896
Mult.: 896
Cages Female 76 Position 19 mm Panel Mount Straight - 55 C + 85 C
TE Connectivity I/O Connectors CAGE ASSEMBLY 1X4 QSFP28 TB Non-Stocked Lead-Time 9 Weeks
Rp2.528.446
Min.: 2.700
Mult.: 27
Cage Assemblies Female Tin Through Hole Press Fit Right Angle - 40 C + 85 C