2763089

Bergquist Company
951-2763089
2763089

Mfr.:

Description:
Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 3.8 W/m-K, Liqui-Form

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
4 Weeks Estimated factory production time.
Minimum: 50   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp1.562.529 Rp78.126.450
Rp1.504.739 Rp150.473.900

Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
TLF LF3800LVO / TLF 3800LVO
Brand: Bergquist Company
Product Type: Thermal Interface Products
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: Liqui-Form
Part # Aliases: SAMPLE LIQUI FORM TLF 3800LVO
Unit Weight: 480 g
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Attributes selected: 0

Datasheet

Data Centre Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

Router Switch & Network Applications

Bergquist Company Router Switch and Network Applications include phase change materials and thermally conductive adhesives designed to dissipate heat away from thermally sensitive components. The utilization of advanced materials in server motherboards and line cards for routers and switches offers benefits such as scale and cost reduction. One small uptick in performance, repeated thousands of times, provides a notable impact on router and switch performance. Thermal products from Bergquist Company help components function properly for optimal operation.

Server Applications

Bergquist Company Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Bergquist Company offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.

Liqui-Form TLF 3800LVO Liquid Formable Gel

Bergquist Company Liqui-Form TLF 3800LVO Liquid Formable Gel provides low volatility, low assembly stress, and high thermal conductivity for high reliability. The 3800LVO is a one-part, pre-cured, liquid thermal interface material (TIM) that is designed for demanding applications. This gel-based medium has a consistent and stable viscosity, allowing for high shot-to-shot consistency for volume manufacturing. Bergquist Liqui-Form TLF 3800LVO Liquid Formable Gel features a high thermal conductivity of 3.8W/m-K, excellent thermal cycling reliability, reworkability, and low siloxane volatility for silicone-sensitive applications.

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