RZ® Z Series Interposer Compression Connectors

AirBorn / Molex RZ® Z Series Interposer Compression Connectors offer a 250VDC rating, 25mΩ contact resistance rating, and 20 to 175 contacts. The components' patented Z-axis compression contact system features solderless BeCu contacts that are compressed under pressure between parallel printed wiring boards or between a printed wiring board and another electronic component. The RZ connectors are engineered to meet strict performance and reliability requirements. Standard versions are available with 2 to 7 rows, 20 to 175 contacts, 1.27mm contact spacing, and standard heights spanning 0.1" to 0.35”. Custom configurations designed to meet specific application needs are also available, and both standard and custom versions are made in the USA.

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Results: 5
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Molex / AirBorn Board to Board & Mezzanine Connectors Low Profile High-Density One Piece Interposer Compression Connector

Molex / AirBorn Rectangular Mil Spec Connectors Z Series Open-Pin Field Compression (z-axis) Interposer Connector, Vertical, 0.050" (1.27mm) Pitch, 0.100" Height, with Through Hole Hardware, 3 Rows, 25 Columns, 75 Circuits

Molex / AirBorn Board to Board & Mezzanine Connectors Low Profile High-Density One Piece Interposer Compression Connector

Molex / AirBorn Board to Board & Mezzanine Connectors Low Profile High-Density One Piece Interposer Compression Connector

Molex / AirBorn Board to Board & Mezzanine Connectors Low Profile High-Density One Piece Interposer Compression Connector