|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp339.401
-
178In Stock
|
Mouser Part No
200-LPAM30010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
178In Stock
|
|
|
Rp339.401
|
|
|
Rp288.583
|
|
|
Rp270.420
|
|
|
Rp257.578
|
|
|
Rp207.860
|
|
|
View
|
|
|
Rp247.304
|
|
|
Rp206.209
|
|
|
Rp205.659
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
Headers
|
180 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-04-2-K-TR
- Samtec
-
1:
Rp288.950
-
196In Stock
|
Mouser Part No
200-LPAM30010L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
196In Stock
|
|
|
Rp288.950
|
|
|
Rp246.203
|
|
|
Rp230.609
|
|
|
Rp219.602
|
|
|
Rp174.654
|
|
|
View
|
|
|
Rp211.713
|
|
|
Rp198.137
|
|
|
Rp153.923
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
475
|
|
|
Plugs
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Straight
|
|
2.2 A
|
250 VAC
|
|
|
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-2-K-TR
- Samtec
-
1:
Rp501.947
-
391In Stock
|
Mouser Part No
200-LPAM40015L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
391In Stock
|
|
|
Rp501.947
|
|
|
Rp426.545
|
|
|
Rp399.576
|
|
|
Rp395.907
|
|
|
Rp343.988
|
|
|
View
|
|
|
Rp395.540
|
|
|
Rp259.779
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-04-2-K-TR
- Samtec
-
1:
Rp254.826
-
120In Stock
|
Mouser Part No
200-LPAM20015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
120In Stock
|
|
|
Rp254.826
|
|
|
Rp243.818
|
|
|
Rp234.462
|
|
|
Rp217.400
|
|
|
Rp158.876
|
|
|
View
|
|
|
Rp186.579
|
|
|
Rp158.876
|
|
|
Rp135.760
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
450
|
|
|
Headers
|
80 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-2-K-TR
- Samtec
-
1:
Rp638.624
-
454In Stock
|
Mouser Part No
200-LPAM40010S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
454In Stock
|
|
|
Rp638.624
|
|
|
Rp610.738
|
|
|
Rp587.989
|
|
|
Rp544.876
|
|
|
Rp398.292
|
|
|
View
|
|
|
Rp468.006
|
|
|
Rp354.628
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-2-K-TR
- Samtec
-
1:
Rp190.615
-
1.248In Stock
|
Mouser Part No
200-LPAM10010L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
1.248In Stock
|
|
|
Rp190.615
|
|
|
Rp177.956
|
|
|
Rp168.233
|
|
|
Rp154.106
|
|
|
Rp132.275
|
|
|
Rp120.900
|
|
Min.: 1
Mult.: 1
:
625
|
|
|
Headers
|
40 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp297.022
-
162In Stock
|
Mouser Part No
200-LPAM20010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
162In Stock
|
|
|
Rp297.022
|
|
|
Rp283.996
|
|
|
Rp273.355
|
|
|
Rp253.542
|
|
|
Rp185.295
|
|
|
View
|
|
|
Rp217.767
|
|
|
Rp158.509
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp574.780
-
302In Stock
|
Mouser Part No
200-LPAM40010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
302In Stock
|
|
|
Rp574.780
|
|
|
Rp549.646
|
|
|
Rp529.099
|
|
|
Rp490.389
|
|
|
Rp358.297
|
|
|
View
|
|
|
Rp421.041
|
|
|
Rp320.138
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-L-08-1-K-TR
- Samtec
-
1:
Rp685.773
-
150In Stock
|
Mouser Part No
200-LPAM50010L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
150In Stock
|
|
|
Rp685.773
|
|
|
Rp655.686
|
|
|
Rp631.102
|
|
|
Rp584.870
|
|
|
Rp427.462
|
|
|
View
|
|
|
Rp502.313
|
|
|
Rp313.533
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-2-K-TR
- Samtec
-
1:
Rp429.113
-
6In Stock
|
Mouser Part No
200-LPAM20015S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
6In Stock
|
|
|
Rp429.113
|
|
|
Rp410.400
|
|
|
Rp394.989
|
|
|
Rp366.003
|
|
|
Rp267.668
|
|
|
View
|
|
|
Rp314.450
|
|
|
Rp228.958
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
160 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-06-2-K-TR
- Samtec
-
1:
Rp303.443
-
232In Stock
|
Mouser Part No
200-LPAM20015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
232In Stock
|
|
|
Rp303.443
|
|
|
Rp290.050
|
|
|
Rp279.226
|
|
|
Rp258.679
|
|
|
Rp189.147
|
|
|
View
|
|
|
Rp222.354
|
|
|
Rp161.812
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Samtec LPAM-30-01.0-S-06-1-K-TR
- LPAM-30-01.0-S-06-1-K-TR
- Samtec
-
1:
Rp396.641
-
275In Stock
-
New Product
|
Mouser Part No
200-LPAM30010S061KTR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
275In Stock
|
|
|
Rp396.641
|
|
|
Rp375.543
|
|
|
Rp361.416
|
|
|
Rp352.610
|
|
|
Rp266.200
|
|
|
View
|
|
|
Rp289.316
|
|
|
Rp222.904
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-2-K-TR
- Samtec
-
1:
Rp303.259
-
18In Stock
|
Mouser Part No
200-LPAM30015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
18In Stock
|
|
|
Rp303.259
|
|
|
Rp289.867
|
|
|
Rp279.043
|
|
|
Rp258.495
|
|
|
Rp188.964
|
|
|
View
|
|
|
Rp222.170
|
|
|
Rp188.964
|
|
|
Rp161.628
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
450
|
|
|
Headers
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-L-08-2-K-TR
- Samtec
-
1:
Rp700.267
-
251In Stock
|
Mouser Part No
200-LPAM50015L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
251In Stock
|
|
|
Rp700.267
|
|
|
Rp669.446
|
|
|
Rp644.312
|
|
|
Rp597.162
|
|
|
Rp512.954
|
|
|
Rp467.640
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-2-K-TR
- Samtec
-
1:
Rp360.866
-
191In Stock
|
Mouser Part No
200-LPAM30015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
191In Stock
|
|
|
Rp360.866
|
|
|
Rp345.088
|
|
|
Rp332.063
|
|
|
Rp307.846
|
|
|
Rp225.105
|
|
|
View
|
|
|
Rp264.366
|
|
|
Rp197.220
|
|
|
Rp194.651
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
180 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-04-2-K-TR
- Samtec
-
1:
Rp249.689
-
306In Stock
|
Mouser Part No
200-LPAM20010L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
306In Stock
|
|
|
Rp249.689
|
|
|
Rp238.865
|
|
|
Rp229.692
|
|
|
Rp212.997
|
|
|
Rp155.574
|
|
|
View
|
|
|
Rp183.093
|
|
|
Rp174.104
|
|
|
Rp133.375
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
475
|
|
|
Headers
|
80 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Solder
|
Straight
|
|
2.2 A
|
250 VAC
|
|
|
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp491.856
-
379In Stock
|
Mouser Part No
200-LPAM50010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
379In Stock
|
|
|
Rp491.856
|
|
|
Rp417.922
|
|
|
Rp403.429
|
|
|
Rp391.871
|
|
|
Rp384.716
|
|
|
View
|
|
|
Rp309.680
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
400 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-04-1-K-TR
- Samtec
-
1:
Rp297.022
-
353In Stock
|
Mouser Part No
200-LPAM30010L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
353In Stock
|
|
|
Rp297.022
|
|
|
Rp283.996
|
|
|
Rp273.355
|
|
|
Rp253.542
|
|
|
Rp185.295
|
|
|
View
|
|
|
Rp217.767
|
|
|
Rp204.558
|
|
|
Rp158.509
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
475
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-08-2-K-TR
- Samtec
-
1:
Rp651.100
-
46In Stock
|
Mouser Part No
200-LPAM40015S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
46In Stock
|
|
|
Rp651.100
|
|
|
Rp622.663
|
|
|
Rp599.180
|
|
|
Rp555.517
|
|
|
View
|
|
|
Rp405.814
|
|
|
Rp476.996
|
|
|
Rp405.814
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-06-1-K-TR
- Samtec
-
1:
Rp303.259
-
185In Stock
|
Mouser Part No
200-LPAM20015L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
185In Stock
|
|
|
Rp303.259
|
|
|
Rp289.867
|
|
|
Rp279.043
|
|
|
Rp258.495
|
|
|
Rp222.170
|
|
|
Rp202.540
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-06-2-K-TR
- Samtec
-
1:
Rp460.118
-
7In Stock
-
600Expected 07/07/2026
|
Mouser Part No
200-LPAM40015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
7In Stock
600Expected 07/07/2026
|
|
|
Rp460.118
|
|
|
Rp439.937
|
|
|
Rp423.426
|
|
|
Rp392.421
|
|
|
Rp337.199
|
|
|
Rp307.296
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp450.578
-
18In Stock
|
Mouser Part No
200-LPAM40010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
18In Stock
|
|
|
Rp450.578
|
|
|
Rp430.948
|
|
|
Rp414.620
|
|
|
Rp384.349
|
|
|
Rp280.877
|
|
|
View
|
|
|
Rp330.228
|
|
|
Rp240.516
|
|
|
Rp206.026
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp450.578
-
325Expected 13/07/2026
|
Mouser Part No
200-LPAM30010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
325Expected 13/07/2026
|
|
|
Rp450.578
|
|
|
Rp430.948
|
|
|
Rp414.620
|
|
|
Rp384.349
|
|
|
Rp280.877
|
|
|
View
|
|
|
Rp330.228
|
|
|
Rp250.790
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-1-K-TR
- Samtec
-
450:
Rp188.964
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM30015L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp188.964
|
|
|
Rp161.628
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-04-1-K-TR
- Samtec
-
475:
Rp235.930
-
Non-Stocked Lead-Time 3 Weeks
-
New Product
|
Mouser Part No
200-LPAM40010L041KTR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp235.930
|
|
|
Rp201.989
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 475
Mult.: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|