|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-L-06-1-K-TR
- Samtec
-
500:
Rp167.499
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF30035L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp167.499
|
|
|
Rp143.649
|
|
Min.: 500
Mult.: 500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-L-08-1-K-TR
- Samtec
-
325:
Rp249.689
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF30035L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp249.689
|
|
|
Rp213.547
|
|
|
Rp183.093
|
|
Min.: 325
Mult.: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-L-08-2-K-TR
- Samtec
-
325:
Rp249.689
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF30035L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp249.689
|
|
|
Rp213.547
|
|
|
Rp183.093
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-S-04-2-K-TR
- Samtec
-
500:
Rp148.052
-
Non-Stocked Lead-Time 11 Weeks
|
Mouser Part No
200-LPAF30035S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 11 Weeks
|
|
|
Rp148.052
|
|
|
Rp126.954
|
|
Min.: 500
Mult.: 500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-S-06-2-K-TR
- Samtec
-
500:
Rp176.122
-
Non-Stocked Lead-Time 11 Weeks
|
Mouser Part No
200-LPAF30035S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 11 Weeks
|
|
|
Rp176.122
|
|
|
Rp150.988
|
|
Min.: 500
Mult.: 500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-S-08-1-K-TR
- Samtec
-
325:
Rp262.531
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF30035S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp262.531
|
|
|
Rp224.739
|
|
|
Rp192.633
|
|
Min.: 325
Mult.: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-04-2-K-TR
- Samtec
-
550:
Rp176.305
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF40030L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp176.305
|
|
|
Rp151.171
|
|
Min.: 550
Mult.: 550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-06-1-K-TR
- Samtec
-
550:
Rp209.695
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF40030L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp209.695
|
|
|
Rp179.791
|
|
Min.: 550
Mult.: 550
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-08-1-K-TR
- Samtec
-
350:
Rp312.432
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF40030L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp312.432
|
|
|
Rp229.325
|
|
Min.: 350
Mult.: 350
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-S-06-2-K-TR
- Samtec
-
550:
Rp219.969
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF40030S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp219.969
|
|
|
Rp188.597
|
|
Min.: 550
Mult.: 550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-04-1-K-TR
- Samtec
-
500:
Rp179.607
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF40035L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp179.607
|
|
|
Rp153.923
|
|
Min.: 500
Mult.: 500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-04-2-K-TR
- Samtec
-
500:
Rp179.607
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF40035L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp179.607
|
|
|
Rp153.923
|
|
Min.: 500
Mult.: 500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-06-2-K-TR
- Samtec
-
500:
Rp213.547
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF40035L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp213.547
|
|
|
Rp183.093
|
|
Min.: 500
Mult.: 500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-08-1-K-TR
- Samtec
-
325:
Rp318.303
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF40035L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-S-04-1-K-TR
- Samtec
-
500:
Rp188.780
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF40035S041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp188.780
|
|
|
Rp161.812
|
|
Min.: 500
Mult.: 500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-S-04-2-K-TR
- Samtec
-
500:
Rp188.780
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF40035S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp188.780
|
|
|
Rp161.812
|
|
Min.: 500
Mult.: 500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-S-08-1-K-TR
- Samtec
-
325:
Rp334.815
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF40035S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp334.815
|
|
|
Rp245.653
|
|
Min.: 325
Mult.: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-L-08-1-K-TR
- Samtec
-
350:
Rp372.791
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF50030L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp372.791
|
|
|
Rp273.539
|
|
Min.: 350
Mult.: 350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-S-08-1-K-TR
- Samtec
-
350:
Rp391.320
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF50030S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp391.320
|
|
|
Rp287.115
|
|
Min.: 350
Mult.: 350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-S-08-2-K-TR
- Samtec
-
350:
Rp391.320
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF50030S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp391.320
|
|
|
Rp287.115
|
|
Min.: 350
Mult.: 350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.5-S-08-1-K-TR
- Samtec
-
325:
Rp399.576
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF50035S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp399.576
|
|
|
Rp292.986
|
|
Min.: 325
Mult.: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.5-S-08-2-K-TR
- Samtec
-
325:
Rp399.576
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF50035S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp399.576
|
|
|
Rp292.986
|
|
Min.: 325
Mult.: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-1-K-TR
- Samtec
-
625:
Rp106.223
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp106.223
|
|
|
Rp90.996
|
|
Min.: 625
Mult.: 625
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-06-1-K-TR
- Samtec
-
400:
Rp148.603
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp148.603
|
|
|
Rp126.404
|
|
|
Rp92.831
|
|
Min.: 400
Mult.: 400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp214.098
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp214.098
|
|
|
Rp199.971
|
|
|
Rp188.964
|
|
|
Rp173.003
|
|
|
Rp148.603
|
|
|
View
|
|
|
Rp148.603
|
|
|
Rp126.404
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Rp92.831
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Min.: 1
Mult.: 1
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LPAM
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Reel, Cut Tape
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