|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp258.679
-
Non-Stocked Lead-Time 11 Weeks
|
Mouser Part No
200-LPAM10010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 11 Weeks
|
|
|
Rp258.679
|
|
|
Rp247.488
|
|
|
Rp238.131
|
|
|
Rp220.702
|
|
|
Rp161.261
|
|
|
View
|
|
|
Rp189.514
|
|
|
Rp161.261
|
|
|
Rp137.962
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-04-2-K-TR
- Samtec
-
625:
Rp111.911
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM10010S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp111.911
|
|
|
Rp95.766
|
|
Min.: 625
Mult.: 625
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-1-K-TR
- Samtec
-
1:
Rp225.289
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010S061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp225.289
|
|
|
Rp210.245
|
|
|
Rp198.871
|
|
|
Rp181.992
|
|
|
Rp156.308
|
|
|
View
|
|
|
Rp156.308
|
|
|
Rp133.009
|
|
|
Rp97.601
|
|
Min.: 1
Mult.: 1
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-2-K-TR
- Samtec
-
400:
Rp156.308
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp156.308
|
|
|
Rp133.009
|
|
|
Rp97.601
|
|
Min.: 400
Mult.: 400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-1-K-TR
- Samtec
-
575:
Rp108.608
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM10015L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp108.608
|
|
|
Rp92.831
|
|
Min.: 575
Mult.: 575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-2-K-TR
- Samtec
-
575:
Rp108.608
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM10015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp108.608
|
|
|
Rp92.831
|
|
Min.: 575
Mult.: 575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-1-K-TR
- Samtec
-
1:
Rp218.684
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAM10015L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp218.684
|
|
|
Rp204.191
|
|
|
Rp193.000
|
|
|
Rp176.672
|
|
|
Rp151.721
|
|
|
View
|
|
|
Rp151.721
|
|
|
Rp129.156
|
|
|
Rp110.443
|
|
Min.: 1
Mult.: 1
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-2-K-TR
- Samtec
-
375:
Rp151.721
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAM10015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp151.721
|
|
|
Rp129.156
|
|
|
Rp110.443
|
|
Min.: 375
Mult.: 375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-04-2-K-TR
- Samtec
-
575:
Rp113.929
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM10015S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp113.929
|
|
|
Rp97.601
|
|
Min.: 575
Mult.: 575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-06-2-K-TR
- Samtec
-
1:
Rp229.692
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAM10015S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp229.692
|
|
|
Rp214.281
|
|
|
Rp202.723
|
|
|
Rp185.478
|
|
|
Rp159.427
|
|
|
View
|
|
|
Rp159.427
|
|
|
Rp135.577
|
|
|
Rp99.435
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-06-1-K-TR
- Samtec
-
325:
Rp174.654
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM20010L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp174.654
|
|
|
Rp149.520
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 325
Mult.: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-2-K-TR
- Samtec
-
300:
Rp222.720
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM20010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp222.720
|
|
|
Rp190.615
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-04-2-K-TR
- Samtec
-
475:
Rp154.473
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM20010S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp154.473
|
|
|
Rp132.091
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 475
Mult.: 475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-06-2-K-TR
- Samtec
-
325:
Rp183.643
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM20010S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp183.643
|
|
|
Rp157.225
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-2-K-TR
- Samtec
-
300:
Rp234.278
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM20010S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp234.278
|
|
|
Rp200.522
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-20-01.5-L-08-2-K-TR
- Samtec
-
1:
Rp364.902
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM20015L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD LOW PRO
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp364.902
|
|
|
Rp348.941
|
|
|
Rp335.732
|
|
|
Rp311.332
|
|
|
Rp227.490
|
|
|
View
|
|
|
Rp267.301
|
|
|
Rp194.651
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-04-1-K-TR
- Samtec
-
450:
Rp157.409
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM20015S041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp157.409
|
|
|
Rp134.660
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 450
Mult.: 450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-04-2-K-TR
- Samtec
-
450:
Rp157.409
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM20015S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp157.409
|
|
|
Rp134.660
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 450
Mult.: 450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-06-1-K-TR
- Samtec
-
300:
Rp187.313
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM20015S061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp187.313
|
|
|
Rp160.161
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-06-2-K-TR
- Samtec
-
300:
Rp187.313
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM20015S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp187.313
|
|
|
Rp160.161
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-1-K-TR
- Samtec
-
300:
Rp238.865
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAM20015S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp238.865
|
|
|
Rp204.374
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-1-K-TR
- Samtec
-
325:
Rp207.860
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM30010L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp207.860
|
|
|
Rp177.773
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-08-1-K-TR
- Samtec
-
325:
Rp264.916
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM30010L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp264.916
|
|
|
Rp226.757
|
|
|
Rp194.284
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-04-2-K-TR
- Samtec
-
475:
Rp183.643
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM30010S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp183.643
|
|
|
Rp157.225
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 475
Mult.: 475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-06-2-K-TR
- Samtec
-
325:
Rp218.501
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM30010S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp218.501
|
|
|
Rp186.946
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|