53254 Series Headers & Wire Housings

Results: 14
Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Type Number of Positions Pitch Number of Rows Mounting Style Termination Style Mounting Angle Contact Gender Contact Plating Mating Post Length Termination Post Length Series Tradename Application Minimum Operating Temperature Maximum Operating Temperature Packaging
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 11Ckt 14.950In Stock
Min.: 1
Mult.: 1

Headers Shrouded 11 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 12Ckt 6.214In Stock
Min.: 1
Mult.: 1

Headers Shrouded 12 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 15Ckt 2.374In Stock
Min.: 1
Mult.: 1

Headers Shrouded 15 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 2mm MicroLatch RA HDR 5CKT Square Pin 6.997In Stock
16.000Expected 04/09/2026
Min.: 1
Mult.: 1

Headers Shrouded 5 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 2.0 WtB Wafer Assy RA 2Ckt 13.601In Stock
32.000Expected 27/11/2026
Min.: 1
Mult.: 1

Headers Shrouded 2 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 4CKT WTB R/A 22.834In Stock
Min.: 1
Mult.: 1

Headers Shrouded 4 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 6CKT WTB RA 3 SIDED SHROUD 13.136In Stock
Min.: 1
Mult.: 1

Headers Shrouded 6 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 3CKT WTB R/A 2.642In Stock
20.010Expected 14/12/2026
Min.: 1
Mult.: 1

Headers Shrouded 3 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 8CKT WTB R/A 2.999In Stock
8.000Expected 08/01/2027
Min.: 1
Mult.: 1

Headers Shrouded 8 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings W-T-B HDR R/A 9P 787In Stock
Min.: 1
Mult.: 1

Headers Shrouded 9 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 10Ckt 6.063In Stock
6.400Expected 19/11/2026
Min.: 1
Mult.: 1

Headers Shrouded 10 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 2MM MICROLTCH HDR RA 13CKT SQ PIN 1.175In Stock
Min.: 1
Mult.: 1

Headers Shrouded 13 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 14Ckt 1.608In Stock
Min.: 1
Mult.: 1

Headers Shrouded 14 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As B Wafer Assy RA 7Ck 6In Stock
12.000Expected 16/11/2026
Min.: 1
Mult.: 1

Headers Shrouded 7 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray