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2485264-2

Name: TE Connectivity 2485264-2
Brand: TE Connectivity
SKU: 571-2485264-2
Price: 28803 IDR
Availability: InStock

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Mouser No:

571-2485264-2

Mfr. No:

2485264-2

Mfr.:

TE Connectivity

Description:

IC & Component Sockets DIP IC SOCKET 14P-Sn

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

2485264-2 Datasheet

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More Information

Learn more about TE Connectivity 2485264-2

In Stock: 7.101

Stock:: 7.101 Can Dispatch Immediately

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Factory Lead Time:: 9 Weeks Estimated factory production time for quantities greater than shown.

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Unit Price:

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Ext. Price:

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp28.803	Rp28.803
	Rp24.584	Rp245.840
	Rp21.648	Rp541.200
	Rp20.364	Rp1.954.944
	Rp19.447	Rp4.978.432
	Rp18.529	Rp9.486.848
	Rp17.043	Rp17.452.032
	Rp15.961	Rp40.349.408
	Rp15.411	Rp77.424.864

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	IC & Component Sockets
RoHS:
Product:	Sockets
Number of Positions:	14 Position
Number of Rows:	2 Row
Type:	DIP Socket
Pitch:	2.54 mm
Termination Style:	Through Hole
Contact Plating:	Tin
Row Spacing:	7.62 mm
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tube
Brand:	TE Connectivity
Contact Material:	Copper
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	1 A
Flammability Rating:	UL 94 V-0
Housing Material:	Thermoplastic (TP)
Mounting Style:	PCB Mount
Product Type:	IC & Component Sockets
Factory Pack Quantity:	32
Subcategory:	IC & Component Sockets

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Datasheet

2485264-2 Datasheet

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CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

DIP (Dual In-Line Package) Sockets

TE Connectivity's (TE) DIP (Dual In-Line Package) Sockets feature two contact configuration options for application flexibility: four-finger and dual leaf. The sockets provide a separable electrical and mechanical connection between the electronic component and the PCB, supporting quick mating and un-mating capability. The DIP sockets are available in open-frame and closed-frame housing with end-to-end and side-to-side stackable options. The DIP sockets' optimised design minimises the risk of the integrated circuit (IC) overheating during soldering and provides improved vibration resistance via the multi-contact beam design. The TE DIP Sockets are ideal for industrial controls, intelligent buildings, medical devices, military and other embedded system applications.