OSD6254-1G-IPM

Octavo Systems
415-OSD6254-1G-IPM
OSD6254-1G-IPM

Mfr.:

Description:
System-On-Modules - SOM System-in-Package: Texas Instruments AM6254 ARM Quad Cortex A53 Processor, 1GB DDR4, Passives - 9mm X 14mm 500 Ball BGA - -40C to 85C

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 128

Stock:
128 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp652.751 Rp652.751
Rp613.307 Rp6.133.070
Rp593.860 Rp14.846.500
Rp575.147 Rp28.757.350
Rp550.013 Rp55.001.300
Rp532.401 Rp96.896.982
546 Quote

Product Attribute Attribute Value Select Attribute
Octavo Systems
Product Category: System-On-Modules - SOM
RoHS:  
OSD62x
1.8 V, 3.3 V
- 40 C
+ 85 C
Tray
Brand: Octavo Systems
Moisture Sensitive: Yes
Number of Cores: 5
Product Type: System-On-Modules - SOM
Factory Pack Quantity: 182
Subcategory: Computing
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Attributes selected: 0

CAHTS:
8542310000
USHTS:
8542310050
ECCN:
5A992.C

OSD62x-PM System-in-Package (SiP)

Octavo Systems OSD62x-PM System-in-Package (SiP) integrates the Texas Instruments AM62 processor, DDR4 memory, and essential passive components. This device features up to quad-core 64-bit Arm® Cortex®-A53 at 1.4GHz, a single-core Arm® Cortex®-M4F at 400MHz, and up to 2GB of DDR4 memory. The OSD62x-PM SiP features a 3D graphics processing unit that supports up to 2048x1080 @60fps and OpenGL ES 3.1 and Vulkan 1.2. The display subsystem supports 2x 1920x1080 @ 60fps, 24-bit RGB parallel interface, and OLDI/LVDS (4 lanes-2x). The OSD62x-PM SiP is available in a single 9mm x 14mm BGA package with a -40°C to 85°C industrial temperature range. Typical applications include building and industrial automation/control, IoT gateway, Artificial Intelligence (AI) at the edge, and Human Machine Interface (HMI).