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Express-SL-i7-6822EQ

Name: ADLINK Technology Express-SL-i7-6822EQ
Brand: ADLINK Technology
SKU: 976-EXP-SL-I7-6822EQ
Price: 27162721 IDR
Availability: OutOfStock

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Mouser No:

976-EXP-SL-I7-6822EQ

Mfr. No:

Express-SL-i7-6822EQ

Mfr.:

ADLINK Technology

Description:

Computer-On-Modules - COM Express-SL-i7-6822EQBasic COM Express Type6 module with 6 Intel Core i7-6822EQ processor at 2.0/2.8GHz with QM170 chipset

Datasheet:

Express-SL-i7-6822EQ Datasheet

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp27.162.721	Rp27.162.721
10	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	ADLINK Technology
Product Category:	Computer-On-Modules - COM
RoHS:
Form Factor:	COM Express Basic Type 6
Brand:	ADLINK Technology
Product Type:	Computer-On-Modules - COM
Series:	Express-SL
Factory Pack Quantity:	1
Subcategory:	Computing
Unit Weight:	211,228 g

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Datasheet

Express-SL-i7-6822EQ Datasheet

PCN

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USHTS:: 8471500150
MXHTS:: 84715001
ECCN:: 4A994

Express-SL/SLE COM

ADLINK Express-SL/SLE is a COM.0 R2.1 Basic Size Type 6 computer-on-module supporting the 64-bit 6th Generation Intel® Core™, Xeon® E3, and Celeron® processors (formerly "Skylake-H") with Intel® QM170, HM170, CM236 Chipset. The Express-SL/SLE provides outstanding, high-performance graphics processing, reduced development time, and long-lifecycle support. The device features Intel Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual-channel memory at 1866/2133MHz with ECC/non-ECC support determined by CPU/chipset combination. This combination ensures the excellent overall performance of the module. High-speed connectivity of the CPU to the Intel QM170, HM170, CM236 Chipset is supported through an Intel Flexible Display Interface and Direct Media Interface.

COM Express Modules

ADLINK Technology has announced COM Express computer-on-modules (COMs) based on the 6th generation Intel Core i7/i5/i3 processors and latest Xeon processors. These modules follow the form, fit, function design principle for optimum flexibility in upgrading and application scalability, enabling accelerated development and faster time-to-market for embedded applications.