FGA66XABM2

Quectel
277-FGA66XABM2
FGA66XABM2

Mfr.:

Description:
Multiprotocol Development Tools Development/Evaluation Board for use with FGA66XABMD

Lifecycle:
New Product:
New from this manufacturer.

Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
100
Minimum: 1   Multiples: 1
Unit Price:
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Ext. Price:
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Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp582.669 Rp582.669

Product Attribute Attribute Value Select Attribute
Quectel
Product Category: Multiprotocol Development Tools
Development Boards
FGA66XABMD
3.14 V to 3.46 V
- 40 C
+ 85 C
Bluetooth
WiFi
Brand: Quectel
For Use With: WiFi, Bluetooth Module
Product Type: Multiprotocol Development Tools
Subcategory: Development Tools
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Attributes selected: 0

Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Modules

Quectel FGA66X Wi-Fi 6, BLE 5.4, and IEEE 802.15.4 Modules are high-performance modules in an LGA package and support the IEEE 802.11ax standard protocol. These modules operate at MCS 0 to MCS 9 rates over a 20MHz bandwidth and 256QAM. The FGA66X modules are designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. The low profile and small size of the LGA package enable the modules to be easily embedded in size-constrained applications and to provide reliable connectivity. The FGA66X modules are available in an ultra-compact size of 23mm x 14mm x 2.2mm to meet the demands of size-sensitive applications. These modules operate over a wide temperature range of -40°C to 85°C and are available in an LGA package. The FGA66X modules are ideal for a variety of smart home and industrial applications.