W25M512JVFIQ

Winbond
454-W25M512JVFIQ
W25M512JVFIQ

Mfr.:

Description:
Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector

Lifecycle:
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Lifecycle information is unclear. Obtain a quote to verify the availability of this part number from the manufacturer.
Datasheet:
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In Stock: 62

Stock:
62 Can Dispatch Immediately
Factory Lead Time:
53 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 62 will be subject to minimum order requirements.
Long lead time reported on this product.
Minimum: 1   Multiples: 1   Maximum: 62
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp139.613 Rp139.613
Rp129.890 Rp1.298.900
Rp126.037 Rp3.150.925
Rp122.001 Rp6.100.050

Product Attribute Attribute Value Select Attribute
Winbond
Product Category: Multichip Packages
RoHS:  
Serial NOR Flash
512 Mbit
SOIC-16
W25M512JV
SMD/SMT
104 MHz
- 40 C
+ 85 C
Brand: Winbond
Data Bus Width: 8 bit
Interface Type: SPI
Moisture Sensitive: Yes
Organisation: 64 M x 8
Packaging: Tray
Product Type: Multichip Packages
Factory Pack Quantity: 176
Subcategory: Memory & Data Storage
Supply Voltage - Max: 3.6 V
Supply Voltage - Min: 2.7 V
Tradename: SpiStack
Unit Weight: 6,820 g
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Attributes selected: 0

CNHTS:
8542329090
USHTS:
8542320051
ECCN:
3A991.b.1.a

Serial MCP Flash Portfolio with SpiStack®

Winbond Serial MCP Flash Portfolio with SpiStack® is based on the W25Q/W25N SpiFlash® series by stacking W25Q16JV and W25N01GV. The portfolio offers flexible memory density and reliability combinations for the low pin count package and Concurrent Operations in Serial Flash memory for the first time. Winbond W25M SpiStack series is ideal for small form factor system designs and applications that demand high Program/Erase data throughput. The series comprises a 1.8V NAND Flash Memory device and a 1.8V Low Power SDRAM device. MCP is an all-in-one package that provides an effective solution for saving Printed Circuit Board (PCB) space. This benefit becomes more critical in small PCBs for modules and space-critical designs, particularly for mobile and portable applications.

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