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eMMC eMMC, 11.5x13 153 ball, 64GB, -25C to 85C
- IMC1B1A8C2A2A1E3A8A0000
- Intelligent Memory
-
Non-Stocked Lead-Time 26 Weeks
-
Factory Special Order
|
Mouser Part No
822-A82A2A1E3A8A0000
Factory Special Order
|
Intelligent Memory
|
eMMC eMMC, 11.5x13 153 ball, 64GB, -25C to 85C
|
|
Non-Stocked Lead-Time 26 Weeks
|
|
|
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FBGA-153
|
64 GB
|
|
|
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eMMC 5.1
|
|
|
- 25 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC Industrial Embedded MMC, EM-30 (153-b), 64 GB, 3D TLC Flash, -40C to +105C
- SFEM064GB2ED1TO-A-6F-111-STD
- Swissbit
-
1:
Rp3.000.488
-
Lead-Time 16 Weeks
-
End of Life
|
Mouser Part No
922-608635
End of Life
|
Swissbit
|
eMMC Industrial Embedded MMC, EM-30 (153-b), 64 GB, 3D TLC Flash, -40C to +105C
|
|
Lead-Time 16 Weeks
|
|
|
Rp3.000.488
|
|
|
Rp2.764.926
|
|
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Rp2.673.012
|
|
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Rp2.597.427
|
|
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Quote
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
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EM-30
|
BGA-153
|
64 GB
|
TLC
|
300 MB/s
|
230 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 105 C
|
|
|
|
|
eMMC ATP TLC eMMC V5.1 153b C-Temp - 64GB
- AF064GEC5X-2002CX
- ATP Electronics
-
760:
Rp456.632
-
Non-Stocked Lead-Time 29 Weeks
|
Mouser Part No
162-064GEC5X-2002CX
|
ATP Electronics
|
eMMC ATP TLC eMMC V5.1 153b C-Temp - 64GB
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
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|
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FBGA-153
|
64 GB
|
|
|
|
|
|
|
- 25 C
|
+ 85 C
|
|
|
|
|
eMMC Industrial Temp. -40C to +85C 11.5x13 TLC eMMC
- AF064GEC5X-2002IX
- ATP Electronics
-
760:
Rp731.822
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-064GEC5X-2002IX
|
ATP Electronics
|
eMMC Industrial Temp. -40C to +85C 11.5x13 TLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
FBGA-153
|
64 GB
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
|
|
|
eMMC
- AF064GEC5X-2004CX
- ATP Electronics
-
760:
Rp447.092
-
Non-Stocked Lead-Time 29 Weeks
|
Mouser Part No
162-AF064GEC5X2004CX
|
ATP Electronics
|
eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
FBGA-153
|
64 GB
|
3D TLC
|
270 MB/s
|
215 MB/s
|
eMMC 5.1 HS400
|
2.7 V
|
3.6 V
|
- 25 C
|
+ 85 C
|
|
|
|
|
eMMC
- AF064GEC5X-2004IX
- ATP Electronics
-
760:
Rp453.513
-
Non-Stocked Lead-Time 29 Weeks
|
Mouser Part No
162-AF064GEC5X2004IX
|
ATP Electronics
|
eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
FBGA-153
|
64 GB
|
3D TLC
|
270 MB/s
|
215 MB/s
|
eMMC 5.1 HS400
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
|
|
|
|
eMMC Conmercial Temp. -25C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
- AF064GEC5X-2006CX
- ATP Electronics
-
1.050:
Rp707.238
-
Non-Stocked Lead-Time 40 Weeks
-
New Product
|
Mouser Part No
162-AF064GEC5X2006CX
New Product
|
ATP Electronics
|
eMMC Conmercial Temp. -25C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 1.050
Mult.: 1.050
|
|
|
|
BGA-153
|
64 GB
|
TLC
|
290 MB/s
|
225 MB/s
|
eMMC 5.1
|
|
|
- 25 C
|
+ 85 C
|
|
|
|
|
eMMC Industrial Temp. -40C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
- AF064GEC5X-2006IX
- ATP Electronics
-
1.050:
Rp722.099
-
Non-Stocked Lead-Time 40 Weeks
-
New Product
|
Mouser Part No
162-AF064GEC5X2006IX
New Product
|
ATP Electronics
|
eMMC Industrial Temp. -40C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 1.050
Mult.: 1.050
|
|
|
|
BGA-153
|
64 GB
|
TLC
|
|
|
eMMC 5.1
|
|
|
- 40 C
|
+ 85 C
|
|
|
|
|
eMMC eMMC 64GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
- ASFC64G31T5-51BINTR
- Alliance Memory
-
1.500:
Rp3.012.597
-
Non-Stocked Lead-Time 30 Weeks
|
Mouser Part No
913-FC64G31T551BINTR
|
Alliance Memory
|
eMMC eMMC 64GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
|
|
Non-Stocked Lead-Time 30 Weeks
|
|
Min.: 1.500
Mult.: 1.500
:
1.500
|
|
|
|
FBGA-153
|
64 GB
|
TLC
|
301 MB/s
|
222 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Reel
|
|
Indonesia
