3.3 V Mobile Modules

Results: 85
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Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Supply Current Transmitting
Supply Current Receiving
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Cellular, NBIoT, LTE
Packaging

Industruino Mobile Modules GSM/GPRS Expansion Module 50In Stock
Min.: 1
Mult.: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz RS-232, UART 3.3 V 32 V 72 mm x 87 mm x 60 mm GSM
IEI Mobile Modules Mini-ITX SBC with Socket G1 for Intel mobile Core i7/i5/i3 and Celeron CPU,VGA/DVI/LVDS/HDMI,Dual PCIe GbE,USB 2.0,Dual PCIe Mini,SATA II and Audio,RoHS
Datasheet
2In Stock
Min.: 1
Mult.: 1
Max.: 2

900 MHz, 1.8 GHz, 2.1 GHz 33 dBm PCI, USB 3.3 V 3.3 V - 30 C + 85 C External 50.95 mm x 30 mm x 4.75 mm Cellular
Quectel Mobile Modules LTE Cat 1bis, 4M, LTE only, No GNSS, No Quecopen, No VoLTE
Datasheet
67In Stock
500Expected 06/10/2026
Min.: 1
Mult.: 1
: 500

ADC, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 17.7 mm x 15.8 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Cat M1/Cat NB2, HW version R1.1
Datasheet
229In Stock
250Expected 01/07/2026
Min.: 1
Mult.: 1
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 23 dBm ADC, GPIO, PCM, UART, USB 2.0 3.3 V 4.3 V 223 mA - 35 C + 75 C 26.5 mm x 22.5 mm x 2.3 mm EGPRS, LTE Cat-M1, LTE Cat NB1 Reel, Cut Tape
Quectel Mobile Modules Cat M1/Cat NB2, HW version R1.2
Datasheet
168In Stock
Min.: 1
Mult.: 1
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz ADC, GPIO, UART, USB 3.3 V 4.3 V 223 mA - 35 C + 75 C 26.5 mm x 22.5 mm x 2.3 mm EGPRS, LTE Cat-M1, LTE Cat NB1 Reel, Cut Tape
Quectel Mobile Modules Cat 1, mPCIe form factor, Japan only
Datasheet
231In Stock
Min.: 1
Mult.: 1
: 100

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 32 mA 32 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules CAT 1
Datasheet
62In Stock
Min.: 1
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 32 mA 32 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Tray
Quectel Mobile Modules CAT 1
Datasheet
286In Stock
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules CAT 1
Datasheet
95In Stock
Min.: 1
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 34 mA 34 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Tray
Quectel Mobile Modules CAT 1
Datasheet
250In Stock
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules CAT 1
Datasheet
181In Stock
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Cat 1, mPCIe form factor, Verizon
Datasheet
17In Stock
Min.: 1
Mult.: 1
: 100

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 30 mA 30 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Seeed Studio Mobile Modules SIM7600G-H4GforJetsonNano 39In Stock
Min.: 1
Mult.: 1
USB 3.3 V 5 V - 30 C + 80 C
Advantech Mobile Modules LTE/HSPA+/GPRS module,USA AT&T, T-Mobile
Datasheet
1In Stock
Min.: 1
Mult.: 1

EWM-C117FL 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz PCIe 3.3 V 3.6 V RF Antenna 50.85 mm x 29.9 mm x 6.2 mm LTE, HSPA+, GPRS
Quectel Mobile Modules Cat 1, 4Gbit ROM+2Gbit RAM, Japan only
Datasheet
93In Stock
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Embedded, 698-960,1710-3800, LTE (4G), PCB, -, -, SMD, 26 x 8 x 3
Datasheet
4In Stock
Min.: 1
Mult.: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 23 dBm ADC, GPIO, PCM, UART, USB 2.0 3.3 V 4.3 V 223 mA - 40 C + 85 C 26.5 mm x 22.5 mm x 2.3 mm EGPRS, LTE Cat-M1, LTE Cat NB1
Quectel Mobile Modules Cat 1 + 3G + 2G, mPCIe form factor, Latin A, Australia, NZ
Datasheet
21In Stock
100Expected 01/12/2026
Min.: 1
Mult.: 1
: 100

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 34 mA 34 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Cat 1 + 3G + 2G, 4Gbit ROM+2Gbit RAM, Support B5, EMEA+India
Datasheet
475Expected 09/07/2026
Min.: 1
Mult.: 1
: 250

824 MHz to 960 MHz, 1.71 GHz to 2.69 GHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Cat 1 + 3G + 2G, 4Gbit ROM+2Gbit RAM, EMEA+India
Datasheet
300On Order
Min.: 1
Mult.: 1
: 100

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 30 mA 30 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Cat 1 + 3G + 2G, 4Gbit ROM+2Gbit RAM, Support B28A, EMEA
Datasheet
250Expected 27/07/2026
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Cat 4 + 3G + 2G, 2Gbit ROM+2Gbit RAM, voice + data, Global
Datasheet
988On Order
Min.: 1
Mult.: 1
: 250

33 dBm I2C, UART, USB 3.3 V 3.3 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm Reel, Cut Tape
Quectel Mobile Modules
3On Order
Min.: 1
Mult.: 1

ADC, GPIO, I2C, PCIe, PCM, SPI, UART, USB 2.0, USB 3.0, USB 3.1 3.3 V 4.4 V - 30 C + 75 C 53 mm x 46 mm x 3.05 mm
Quectel Mobile Modules Cat 1 + 3G + 2G, mPCIe form factor, EMEA
Datasheet
199Expected 29/07/2026
Min.: 1
Mult.: 1
: 100

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 23 mA 23 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules LTE CAT 1bis, 4M, LTE only, No GNSS, No Quecopen, No VoLTE
Datasheet
487Expected 08/10/2026
Min.: 1
Mult.: 1
: 500

ADC, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 17.7 mm x 15.8 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
u-blox Mobile Modules LTE/HSPA+/GSM module for Softbank (JP) Cat 4, B1, B3, B5, B7, B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Datasheet
Non-Stocked
Min.: 160
Mult.: 160

1.9 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE