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DSTCP-MTP

Name: L-Com DSTCP-MTP
Brand: L-Com
SKU: 17-DSTCP-MTP
Price: 286931 IDR
Availability: InStock

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See Product Specifications

Mouser No:

17-DSTCP-MTP

Mfr. No:

DSTCP-MTP

Mfr.:

L-Com

Description:

Fibre Optic Connectors DUST CAP FIBER MTP COUPLER

Lifecycle:

New At Mouser

Datasheet:

DSTCP-MTP Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about L-Com DSTCP-MTP

In Stock: 80

Stock:: 80 Can Dispatch Immediately

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Factory Lead Time:: 5 Weeks Estimated factory production time for quantities greater than shown.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp286.931	Rp286.931
	Rp243.635	Rp2.436.350
	Rp240.883	Rp12.044.150
	Rp207.126	Rp20.712.600
	Rp194.101	Rp48.525.250
	Rp184.928	Rp92.464.000
	Rp176.122	Rp176.122.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	L-Com
Product Category:	Fibre Optic Connectors
RoHS:
Series:	Interconnect
Product:	Accessories
Color:	Black
Accessory Type:	Dust Cap
Body Material:	Thermoplastic Elastomer (TPE)
Brand:	L-Com
Product Type:	Fiber Optic Connectors
Factory Pack Quantity:	1
Subcategory:	Fiber Optic
Type:	Accessory
Unit Weight:	4,536 g

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Datasheet

DSTCP-MTP Datasheet (PDF)

USHTS:: 3923500000
JPHTS:: 392350000
KRHTS:: 3923500000
TARIC:: 8536700090
MXHTS:: 3923500100
BRHTS:: 39235000
ECCN:: EAR99

Fiber Optic Solutions

L-Com Fiber Optic Solutions include both adapters and connectors that offer high-speed connectivity, increasing productivity and enhancing signal strength. Fiber optic cabling features a lightweight design that makes it easy to use while providing better reliability and security through resistance to human or electrical interference. These products have a wide range of specifications and types of construction, ensuring engineers find the ideal fit for any project. L-Com Fiber Optic Solutions are suitable for data communications, wireless infrastructure, harsh environments, and military applications.