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106105-1100

Name: Molex 106105-1100
Brand: Molex
SKU: 538-106105-1100
Price: 1452820 IDR
Availability: OutOfStock

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Mouser No:

538-106105-1100

Mfr. No:

106105-1100

Mfr.:

Molex

Description:

Fibre Optic Connectors DAUGHTERBOARD ASSEMB MBLY (SCREW VERSION)

Datasheet:

106105-1100 Datasheet

ECAD Model:

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More Information

Learn more about Molex 106105-1100

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 14 Weeks Estimated factory production time.

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Minimum: 50 Multiples: 50

Unit Price:

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Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp1.452.820	Rp72.641.000
	Rp1.440.895	Rp144.089.500
250	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Fibre Optic Connectors
RoHS:
Series:	106105
Product:	Housings
Mode:	Multimode, Singlemode
Color:	Black
Number of Positions:	4 Position
Body Material:	Thermoplastic (TP)
Brand:	Molex
Product Type:	Fiber Optic Connectors
Factory Pack Quantity:	1
Subcategory:	Fiber Optic
Tradename:	HBMT
Part # Aliases:	1061051100 861051100
Unit Weight:	13,090 g

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Datasheet

106105-1100 Datasheet

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536700000
USHTS:: 8536700000
JPHTS:: 853670000
TARIC:: 8536700099
MXHTS:: 8536700100
BRHTS:: 85367000
ECCN:: EAR99

HBMT™ MT High-Density Backplane Connectors

Molex HBMT™ MT High-Density Backplane Connectors offer a seamless transition from PC board components to the optical backplane utilizing up to 96x fiber MT ferrules. HBMT features a blind-mate interface for easy insertion, removal, and exchange of the daughter card without disrupting the input/output ports or associated cabling. The connectors support next-generation products in the telecommunications, data networking/storage, and medical diagnostics markets.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.