|
|
Sensor Interface DICE 304? WAFER, SAWN ON FRAME, NO INKIN
Renesas Electronics ZSSC3281CI5C
- ZSSC3281CI5C
- Renesas Electronics
-
1:
Rp136.494
-
Non-Stocked Lead-Time 22 Weeks
-
New Product
|
Mouser Part No
964-ZSSC3281CI5C
New Product
|
Renesas Electronics
|
Sensor Interface DICE 304? WAFER, SAWN ON FRAME, NO INKIN
|
|
Non-Stocked Lead-Time 22 Weeks
|
|
|
Rp136.494
|
|
|
Rp103.471
|
|
|
Rp96.500
|
|
|
Rp84.759
|
|
|
View
|
|
|
Rp80.539
|
|
|
Rp72.100
|
|
|
Rp60.909
|
|
|
Rp58.157
|
|
Min.: 1
Mult.: 1
|
|
|
|
I2C, SPI
|
5.5 V
|
1.8 V
|
8 mA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
|
|
|
|
|
|
|
Sensor Interface SMART SENSOR -> BUMPED DIE
Renesas Electronics ZSSC3281CI8R
- ZSSC3281CI8R
- Renesas Electronics
-
1:
Rp150.988
-
Non-Stocked Lead-Time 18 Weeks
-
New Product
|
Mouser Part No
964-ZSSC3281CI8R
New Product
|
Renesas Electronics
|
Sensor Interface SMART SENSOR -> BUMPED DIE
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
|
Rp150.988
|
|
|
Rp105.490
|
|
|
Rp100.536
|
|
|
Rp87.327
|
|
|
Rp83.291
|
|
|
View
|
|
|
Rp75.952
|
|
|
Rp67.513
|
|
|
Rp65.495
|
|
Min.: 1
Mult.: 1
|
|
|
|
I2C, SPI
|
5.5 V
|
1.8 V
|
8 mA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
|
|
|
Reel, Cut Tape, MouseReel
|
|
|
|
Sensor Interface DICE ON 304 MICRO METER WAFER NO INKING
Renesas Electronics ZSSC3286CI1B
- ZSSC3286CI1B
- Renesas Electronics
-
2.092:
Rp66.046
-
Non-Stocked Lead-Time 25 Weeks
-
New Product
|
Mouser Part No
964-ZSSC3286CI1B
New Product
|
Renesas Electronics
|
Sensor Interface DICE ON 304 MICRO METER WAFER NO INKING
|
|
Non-Stocked Lead-Time 25 Weeks
|
|
Min.: 2.092
Mult.: 2.092
|
|
|
|
I2C, UART
|
5.5 V
|
1.8 V
|
8 mA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
|
|
|
|
|
|
|
Sensor Interface DICE ON 304 MICRO METER WAFER NO INKING
Renesas Electronics ZSSC3286CI1C
- ZSSC3286CI1C
- Renesas Electronics
-
2.092:
Rp66.596
-
Non-Stocked Lead-Time 25 Weeks
-
New Product
|
Mouser Part No
964-ZSSC3286CI1C
New Product
|
Renesas Electronics
|
Sensor Interface DICE ON 304 MICRO METER WAFER NO INKING
|
|
Non-Stocked Lead-Time 25 Weeks
|
|
Min.: 2.092
Mult.: 2.092
|
|
|
|
I2C, UART
|
5.5 V
|
1.8 V
|
8 mA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
|
|
|
|
|
|
|
Sensor Interface DICE ON 304 MICRO METER WAFER WITH INKIN
Renesas Electronics ZSSC3286CI5B
- ZSSC3286CI5B
- Renesas Electronics
-
2.092:
Rp66.046
-
Non-Stocked Lead-Time 19 Weeks
-
New Product
|
Mouser Part No
964-ZSSC3286CI5B
New Product
|
Renesas Electronics
|
Sensor Interface DICE ON 304 MICRO METER WAFER WITH INKIN
|
|
Non-Stocked Lead-Time 19 Weeks
|
|
Min.: 2.092
Mult.: 2.092
|
|
|
|
I2C, UART
|
5.5 V
|
1.8 V
|
8 mA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
|
|
|
|
|
|
|
Sensor Interface DICE ON FRAME ON 304 MICRO METER WAFER W
Renesas Electronics ZSSC3286CI5C
- ZSSC3286CI5C
- Renesas Electronics
-
1:
Rp153.189
-
Non-Stocked Lead-Time 19 Weeks
-
New Product
|
Mouser Part No
964-ZSSC3286CI5C
New Product
|
Renesas Electronics
|
Sensor Interface DICE ON FRAME ON 304 MICRO METER WAFER W
|
|
Non-Stocked Lead-Time 19 Weeks
|
|
|
Rp153.189
|
|
|
Rp107.141
|
|
|
Rp102.004
|
|
|
Rp88.611
|
|
|
View
|
|
|
Rp84.575
|
|
|
Rp77.237
|
|
|
Rp68.431
|
|
|
Rp66.596
|
|
Min.: 1
Mult.: 1
|
|
|
|
I2C, UART
|
5.5 V
|
1.8 V
|
8 mA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
|
|
|
|
|
|
|
Sensor Interface SMART SENSOR -> BUMPED DIE
Renesas Electronics ZSSC3286CI8R
- ZSSC3286CI8R
- Renesas Electronics
-
2.500:
Rp75.219
-
Non-Stocked Lead-Time 37 Weeks
-
New Product
|
Mouser Part No
964-ZSSC3286CI8R
New Product
|
Renesas Electronics
|
Sensor Interface SMART SENSOR -> BUMPED DIE
|
|
Non-Stocked Lead-Time 37 Weeks
|
|
Min.: 2.500
Mult.: 2.500
|
|
|
|
I2C, UART
|
5.5 V
|
1.8 V
|
8 mA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
WLCSP-40
|
|
|
Reel
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC3018BA2C
- ZSSC3018BA2C
- Renesas Electronics
-
16.000:
Rp39.627
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
968-ZSSC3018BA2C
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 16.000
Mult.: 16.000
|
|
|
Sensor Signal Conditioner
|
I2C/SPI
|
3.6 V
|
1.68 V
|
1 mA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
Die
|
|
|
Tray
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC3135BE1C
- ZSSC3135BE1C
- Renesas Electronics
-
2.800:
Rp48.800
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC3135BE1C
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.800
Mult.: 2.800
|
|
|
Sensor Signal Conditioner for Piezoresistive Bridge Sensors
|
I2C
|
5.5 V
|
4.5 V
|
5.5 mA
|
- 40 C
|
+ 150 C
|
SMD/SMT
|
Die
|
|
|
Tray
|
|
|
|
Sensor Interface WAFER (UNSAWN) - BOX
Renesas Electronics ZSSC3154BE1B
- ZSSC3154BE1B
- Renesas Electronics
-
2.700:
Rp51.002
-
Non-Stocked Lead-Time 24 Weeks
-
New Product
|
Mouser Part No
968-ZSSC3154BE1B
New Product
|
Renesas Electronics
|
Sensor Interface WAFER (UNSAWN) - BOX
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.700
Mult.: 2.700
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
Wafer Pack
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
Renesas Electronics ZSSC3154BE1D
- ZSSC3154BE1D
- Renesas Electronics
-
1:
Rp216.116
-
Non-Stocked Lead-Time 24 Weeks
-
New Product
|
Mouser Part No
968-ZSSC3154BE1D
New Product
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
|
Rp216.116
|
|
|
Rp179.791
|
|
|
Rp150.621
|
|
|
Rp141.815
|
|
|
View
|
|
|
Rp136.678
|
|
|
Rp130.807
|
|
|
Rp123.836
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
Waffle
|
|
|
|
Sensor Interface WAFER (UNSAWN) - BOX
Renesas / Intersil ZSSC3170EE1B
- ZSSC3170EE1B
- Renesas / Intersil
-
2.300:
Rp54.304
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC3170EE1B
|
Renesas / Intersil
|
Sensor Interface WAFER (UNSAWN) - BOX
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.300
Mult.: 2.300
|
|
|
Automotive
|
1-Wire, I2C, LIN, PWM
|
18 V
|
7 V
|
|
- 40 C
|
+ 150 C
|
SMD/SMT
|
Wafer
|
|
|
Wafer Pack
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas / Intersil ZSSC3170EE1C
- ZSSC3170EE1C
- Renesas / Intersil
-
2.300:
Rp55.772
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC3170EE1C
|
Renesas / Intersil
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.300
Mult.: 2.300
|
|
|
Automotive
|
1-Wire, I2C, LIN, PWM
|
18 V
|
7 V
|
|
- 40 C
|
+ 150 C
|
SMD/SMT
|
Wafer
|
|
|
|
|
|
|
Sensor Interface WAFER (UNSAWN) - BOX
Renesas / Intersil ZSSC3170FE1B
- ZSSC3170FE1B
- Renesas / Intersil
-
2.300:
Rp55.221
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC3170FE1B
|
Renesas / Intersil
|
Sensor Interface WAFER (UNSAWN) - BOX
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.300
Mult.: 2.300
|
|
|
Automotive
|
1-Wire, I2C, LIN, PWM
|
18 V
|
7 V
|
|
- 40 C
|
+ 150 C
|
SMD/SMT
|
Wafer
|
|
|
Wafer Pack
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas / Intersil ZSSC3170FE1C
- ZSSC3170FE1C
- Renesas / Intersil
-
2.300:
Rp57.056
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC3170FE1C
|
Renesas / Intersil
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.300
Mult.: 2.300
|
|
|
Automotive
|
1-Wire, I2C, LIN, PWM
|
18 V
|
7 V
|
|
- 40 C
|
+ 150 C
|
SMD/SMT
|
Wafer
|
|
|
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC3218BI1C
- ZSSC3218BI1C
- Renesas Electronics
-
16.500:
Rp22.015
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
968-ZSSC3218BI1C
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 16.500
Mult.: 16.500
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
Tray
|
|
|
|
Sensor Interface TSSOP16
Renesas Electronics ZSSC4132CE5R
- ZSSC4132CE5R
- Renesas Electronics
-
4.000:
Rp53.937
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4132CE5R
|
Renesas Electronics
|
Sensor Interface TSSOP16
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.000
Mult.: 4.000
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
TSSOP-16
|
|
|
Reel
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC4151CE1C
- ZSSC4151CE1C
- Renesas Electronics
-
4.347:
Rp27.152
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4151CE1C
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.347
Mult.: 4.347
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
Tray
|
|
|
|
Sensor Interface UNSAWN WAFER IN WAFER BOX
Renesas Electronics ZSSC4161DE1B
- ZSSC4161DE1B
- Renesas Electronics
-
4.730:
Rp27.152
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4161DE1B
|
Renesas Electronics
|
Sensor Interface UNSAWN WAFER IN WAFER BOX
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.730
Mult.: 4.730
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
Gel Pack
|
|
|
|
Sensor Interface TESTED WAFER -CFG 4161_0500_03 V2.2
Renesas Electronics ZSSC4161DE1B-APB
- ZSSC4161DE1B-APB
- Renesas Electronics
-
4.730:
Rp34.307
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4161DE1B-APB
|
Renesas Electronics
|
Sensor Interface TESTED WAFER -CFG 4161_0500_03 V2.2
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.730
Mult.: 4.730
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
Gel Pack
|
|
|
|
Sensor Interface SAWN WAFER ON WAFER FRAME
Renesas Electronics ZSSC4161DE1C
- ZSSC4161DE1C
- Renesas Electronics
-
4.730:
Rp28.069
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4161DE1C
|
Renesas Electronics
|
Sensor Interface SAWN WAFER ON WAFER FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.730
Mult.: 4.730
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
Tray
|
|
|
|
Sensor Interface TESTED DIE, SAWN ON FOIL -CFG 4161_0500_
Renesas Electronics ZSSC4161DE1C-APB
- ZSSC4161DE1C-APB
- Renesas Electronics
-
4.730:
Rp35.591
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4161DE1C-APB
|
Renesas Electronics
|
Sensor Interface TESTED DIE, SAWN ON FOIL -CFG 4161_0500_
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.730
Mult.: 4.730
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
Tray
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
Renesas Electronics ZSSC4165DE1D-ES
- ZSSC4165DE1D-ES
- Renesas Electronics
-
1:
Rp158.693
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4165DE1D-ES
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
|
Rp158.693
|
|
|
Rp113.745
|
|
|
Rp108.608
|
|
|
Rp94.298
|
|
|
View
|
|
|
Rp89.895
|
|
|
Rp82.007
|
|
|
Rp71.366
|
|
|
Rp68.798
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
Sensor
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
Waffle
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC4169DE1C-APC
- ZSSC4169DE1C-APC
- Renesas Electronics
-
4.730:
Rp34.307
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4169DE1C-APC
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.730
Mult.: 4.730
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
Tray
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC3135BA1C
- ZSSC3135BA1C
- Renesas Electronics
-
2.800:
Rp46.782
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
972-ZSPM2000ZA3B
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.800
Mult.: 2.800
|
|
|
Sensor Signal Conditioner for Piezoresistive Bridge Sensors
|
I2C
|
5.5 V
|
4.5 V
|
5.5 mA
|
- 40 C
|
+ 150 C
|
SMD/SMT
|
Die
|
|
|
Tray
|
|