|
|
Sensor Interface WAFER (UNSAWN) - BOX
Renesas Electronics ZSSC3123AA1B
- ZSSC3123AA1B
- Renesas Electronics
-
9.000:
Rp22.015
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
964-ZSSC3123AA1B
|
Renesas Electronics
|
Sensor Interface WAFER (UNSAWN) - BOX
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 9.000
Mult.: 9.000
|
|
|
Capacitive Sensor Signal Conditioner with Digital Output
|
I2C, Serial, SPI
|
5.5 V
|
2.3 V
|
100 uA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface WAFER (UNSAWN) - BOX
Renesas Electronics ZSSC3123AI1B
- ZSSC3123AI1B
- Renesas Electronics
-
9.000:
Rp28.253
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
964-ZSSC3123AI1B
|
Renesas Electronics
|
Sensor Interface WAFER (UNSAWN) - BOX
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 9.000
Mult.: 9.000
|
|
|
Capacitive Sensor Signal Conditioner with Digital Output
|
I2C, Serial, SPI
|
5.5 V
|
2.3 V
|
100 uA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface WAFER (UNSAWN) - BOX
Renesas Electronics ZSSC3135BA1B
- ZSSC3135BA1B
- Renesas Electronics
-
2.800:
Rp45.865
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
964-ZSSC3135BA1B
|
Renesas Electronics
|
Sensor Interface WAFER (UNSAWN) - BOX
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.800
Mult.: 2.800
|
|
|
Sensor Signal Conditioner for Piezoresistive Bridge Sensors
|
I2C
|
5.5 V
|
4.5 V
|
5.5 mA
|
- 40 C
|
+ 150 C
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
Renesas Electronics ZSSC3135BA1D
- ZSSC3135BA1D
- Renesas Electronics
-
1:
Rp206.026
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
964-ZSSC3135BA1D
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
|
Rp206.026
|
|
|
Rp163.830
|
|
|
Rp139.063
|
|
|
Rp111.544
|
|
|
View
|
|
|
Rp105.673
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
Sensor Signal Conditioner for Piezoresistive Bridge Sensors
|
I2C
|
5.5 V
|
4.5 V
|
5.5 mA
|
- 40 C
|
+ 150 C
|
SMD/SMT
|
Die
|
|
Waffle
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
Renesas Electronics ZSSC3135BE1D
- ZSSC3135BE1D
- Renesas Electronics
-
1:
Rp218.868
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
964-ZSSC3135BE1D
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
|
Rp218.868
|
|
|
Rp173.003
|
|
|
Rp146.951
|
|
|
Rp118.148
|
|
|
View
|
|
|
Rp111.177
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
Sensor Signal Conditioner for Piezoresistive Bridge Sensors
|
I2C
|
5.5 V
|
4.5 V
|
5.5 mA
|
- 40 C
|
+ 150 C
|
SMD/SMT
|
Die
|
|
Waffle
|
|
|
|
Sensor Interface WAFER (UNSAWN) - BOX
Renesas Electronics ZSSC3154BA1B
- ZSSC3154BA1B
- Renesas Electronics
-
2.700:
Rp52.653
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
964-ZSSC3154BA1B
|
Renesas Electronics
|
Sensor Interface WAFER (UNSAWN) - BOX
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.700
Mult.: 2.700
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
Renesas Electronics ZSSC3154BA1D
- ZSSC3154BA1D
- Renesas Electronics
-
1:
Rp226.390
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
964-ZSSC3154BA1D
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
|
Rp226.390
|
|
|
Rp188.413
|
|
|
Rp159.977
|
|
|
Rp127.505
|
|
|
View
|
|
|
Rp121.451
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Waffle
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC3154BE1C
- ZSSC3154BE1C
- Renesas Electronics
-
2.700:
Rp55.221
-
Non-Stocked Lead-Time 24 Weeks
-
New Product
|
Mouser Part No
964-ZSSC3154BE1C
New Product
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.700
Mult.: 2.700
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
|
|
|
|
Sensor Interface WAFER (UNSAWN) - BOX
Renesas Electronics ZSSC3224BI1B
- ZSSC3224BI1B
- Renesas Electronics
-
16.500:
Rp24.400
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
964-ZSSC3224BI1B
|
Renesas Electronics
|
Sensor Interface WAFER (UNSAWN) - BOX
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 16.500
Mult.: 16.500
|
|
|
Sensor Signal Conditioner
|
I2C, SPI
|
3.6 V
|
1.68 V
|
1 mA
|
- 40 C
|
+ 85 C
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface WAFER UNSAWN, 304
Renesas Electronics ZSSC3230BC1B
- ZSSC3230BC1B
- Renesas Electronics
-
21.787:
Rp19.997
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
964-ZSSC3230BC1B
|
Renesas Electronics
|
Sensor Interface WAFER UNSAWN, 304
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 21.787
Mult.: 21.787
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface OPN - WAFER UNSAWN, 725
Renesas Electronics ZSSC3230BC2B
- ZSSC3230BC2B
- Renesas Electronics
-
21.787:
Rp19.997
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
964-ZSSC3230BC2B
|
Renesas Electronics
|
Sensor Interface OPN - WAFER UNSAWN, 725
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 21.787
Mult.: 21.787
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface WAFER UNSAWN, 304U, WITH INKING
Renesas Electronics ZSSC3230BC5B
- ZSSC3230BC5B
- Renesas Electronics
-
21.787:
Rp19.997
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
964-ZSSC3230BC5B
|
Renesas Electronics
|
Sensor Interface WAFER UNSAWN, 304U, WITH INKING
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 21.787
Mult.: 21.787
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface ZSSC3230BI6B (WAFER UNSAWN, 725, WITH IN
Renesas Electronics ZSSC3230BI6B
- ZSSC3230BI6B
- Renesas Electronics
-
21.787:
Rp20.914
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
964-ZSSC3230BI6B
|
Renesas Electronics
|
Sensor Interface ZSSC3230BI6B (WAFER UNSAWN, 725, WITH IN
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 21.787
Mult.: 21.787
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC3018BA2C
- ZSSC3018BA2C
- Renesas Electronics
-
16.000:
Rp37.976
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
968-ZSSC3018BA2C
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 16.000
Mult.: 16.000
|
|
|
Sensor Signal Conditioner
|
I2C/SPI
|
3.6 V
|
1.68 V
|
1 mA
|
- 40 C
|
+ 125 C
|
SMD/SMT
|
Die
|
|
Tray
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC3135BE1C
- ZSSC3135BE1C
- Renesas Electronics
-
2.800:
Rp50.452
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC3135BE1C
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.800
Mult.: 2.800
|
|
|
Sensor Signal Conditioner for Piezoresistive Bridge Sensors
|
I2C
|
5.5 V
|
4.5 V
|
5.5 mA
|
- 40 C
|
+ 150 C
|
SMD/SMT
|
Die
|
|
Tray
|
|
|
|
Sensor Interface WAFER (UNSAWN) - BOX
Renesas Electronics ZSSC3154BE1B
- ZSSC3154BE1B
- Renesas Electronics
-
2.700:
Rp55.221
-
Non-Stocked Lead-Time 24 Weeks
-
New Product
|
Mouser Part No
968-ZSSC3154BE1B
New Product
|
Renesas Electronics
|
Sensor Interface WAFER (UNSAWN) - BOX
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.700
Mult.: 2.700
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Wafer Pack
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
Renesas Electronics ZSSC3154BE1D
- ZSSC3154BE1D
- Renesas Electronics
-
1:
Rp248.588
-
Non-Stocked Lead-Time 24 Weeks
-
New Product
|
Mouser Part No
968-ZSSC3154BE1D
New Product
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
|
Rp248.588
|
|
|
Rp195.752
|
|
|
Rp166.215
|
|
|
Rp151.355
|
|
|
View
|
|
|
Rp145.117
|
|
|
Rp137.412
|
|
|
Rp130.257
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Waffle
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC3218BI1C
- ZSSC3218BI1C
- Renesas Electronics
-
16.500:
Rp23.483
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
968-ZSSC3218BI1C
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 16.500
Mult.: 16.500
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Tray
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC4151CE1C
- ZSSC4151CE1C
- Renesas Electronics
-
4.347:
Rp27.152
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4151CE1C
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.347
Mult.: 4.347
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Tray
|
|
|
|
Sensor Interface UNSAWN WAFER IN WAFER BOX
Renesas Electronics ZSSC4161DE1B
- ZSSC4161DE1B
- Renesas Electronics
-
4.730:
Rp27.152
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4161DE1B
|
Renesas Electronics
|
Sensor Interface UNSAWN WAFER IN WAFER BOX
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.730
Mult.: 4.730
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface TESTED WAFER -CFG 4161_0500_03 V2.2
Renesas Electronics ZSSC4161DE1B-APB
- ZSSC4161DE1B-APB
- Renesas Electronics
-
4.730:
Rp34.307
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4161DE1B-APB
|
Renesas Electronics
|
Sensor Interface TESTED WAFER -CFG 4161_0500_03 V2.2
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.730
Mult.: 4.730
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Gel Pack
|
|
|
|
Sensor Interface SAWN WAFER ON WAFER FRAME
Renesas Electronics ZSSC4161DE1C
- ZSSC4161DE1C
- Renesas Electronics
-
4.730:
Rp28.069
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4161DE1C
|
Renesas Electronics
|
Sensor Interface SAWN WAFER ON WAFER FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.730
Mult.: 4.730
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Tray
|
|
|
|
Sensor Interface TESTED DIE, SAWN ON FOIL -CFG 4161_0500_
Renesas Electronics ZSSC4161DE1C-APB
- ZSSC4161DE1C-APB
- Renesas Electronics
-
4.730:
Rp35.591
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4161DE1C-APB
|
Renesas Electronics
|
Sensor Interface TESTED DIE, SAWN ON FOIL -CFG 4161_0500_
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.730
Mult.: 4.730
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Tray
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
Renesas Electronics ZSSC4165DE1D-ES
- ZSSC4165DE1D-ES
- Renesas Electronics
-
1:
Rp163.096
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4165DE1D-ES
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
|
Rp163.096
|
|
|
Rp116.864
|
|
|
Rp99.068
|
|
|
Rp80.355
|
|
|
View
|
|
|
Rp79.438
|
|
|
Rp75.035
|
|
|
Rp74.118
|
|
Min.: 1
Mult.: 1
|
|
|
Sensor
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Waffle
|
|
|
|
Sensor Interface DICE (WAFER SAWN) - FRAME
Renesas Electronics ZSSC4169DE1C-APC
- ZSSC4169DE1C-APC
- Renesas Electronics
-
4.730:
Rp34.307
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
968-ZSSC4169DE1C-APC
|
Renesas Electronics
|
Sensor Interface DICE (WAFER SAWN) - FRAME
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 4.730
Mult.: 4.730
|
|
|
|
|
|
|
|
|
|
SMD/SMT
|
Die
|
|
Tray
|
|