Die Sensor Interface

Results: 91
Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Interface Type Supply Voltage - Max Supply Voltage - Min Operating Supply Current Minimum Operating Temperature Maximum Operating Temperature Mounting Style Package/Case ESD Protection Packaging
Renesas Electronics ZSSC3230BI2B
Renesas Electronics Sensor Interface ZSSC3230BI2B (WAFER UNSAWN, 725) Non-Stocked Lead-Time 18 Weeks
Min.: 21.787
Mult.: 21.787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3230BI5B
Renesas Electronics Sensor Interface ZSSC3230BI5B (WAFER UNSAWN, 304, WITH IN Non-Stocked Lead-Time 18 Weeks
Min.: 21.787
Mult.: 21.787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4151CE1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 24 Weeks
Min.: 4.347
Mult.: 4.347

Sensor Signal Conditioner I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
ScioSense PS09 DICE
ScioSense Sensor Interface Resistance-to-digital converter dice in waffle pack Non-Stocked Lead-Time 26 Weeks
Min.: 575
Mult.: 575

SMD/SMT Die
Renesas Electronics ZSC31150GAD
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK

SMD/SMT Die Waffle
Renesas Electronics ZSSC3135BA1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3135BA1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Waffle
Renesas Electronics ZSSC3135BE1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Waffle
Renesas Electronics ZSSC3135BE1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Tray
Renesas Electronics ZSSC3135BA1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Tray
Renesas Electronics ZSSC3135BE1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3138BA1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3138BA1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK

SMD/SMT Die Waffle
Renesas Electronics ZSSC3138BA1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME

Sensor Signal Conditioner SMD/SMT Die Tray
Renesas Electronics ZSSC4151CE1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK

SMD/SMT Die Waffle
Renesas Electronics ZSSC4161DE1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK

Sensor - 40 C + 150 C SMD/SMT Die Waffle