SECO-RSL10-CAM-GEVB

onsemi
863-SECORSL10CAMGEVB
SECO-RSL10-CAM-GEVB

Mfr.:

Description:
Temperature Sensor Development Tools PORTABLE ULTRA-LOW POWER (ULP) IMAGE PROCESSING AND WIRELESS CONNECTIVITY BOARD

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In Stock: 10

Stock:
10 Can Dispatch Immediately
Quantities greater than 10 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
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Qty. Unit Price
Ext. Price
Rp4.040.340 Rp4.040.340

Product Attribute Attribute Value Select Attribute
onsemi
Product Category: Temperature Sensor Development Tools
RoHS:  
Brand: onsemi
Product Type: Temperature Sensor Development Tools
Factory Pack Quantity: 1
Subcategory: Development Tools
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CAHTS:
8473302000
USHTS:
8473301180
MXHTS:
8473300401
ECCN:
5A991.g

BLUETOOTH® IoT Development Kits

onsemi BLUETOOTH® IoT Development Kits are a comprehensive node-to-cloud, modular IoT platform that allows the development of various BLE-based use cases. These IoT development kits are built using RSL10 low-power BLUETOOTH 5 certified System-on-a-Chip (SoC), which serves as a baseboard for the development kit. The BLUETOOTH IoT development kits feature optimized power consumption, ready-to-use sample code, and modular hardware consisting of sensors and actuators. The sample code is present in the CMSIS pack of the development software and can be used for detailed documentation and several use cases. These development kits also come with a mobile app that interacts with the actuators and sensors.

SECO-RSL10-CAM-GEVB RSL10 Smart Shot Camera

onsemi SECO-RSL10-CAM-GEVB RSL10 Smart Shot Camera is a complete node-to-cloud platform that enables smart image capture for a wide range of applications. This camera-based on RSL10 SIP and ARX3A0 CMOS image sensor features multiple trigger modes including time, motion detection, and environmental sensor triggers. The RSL10 SIP serves as the processing hub of the camera, enabling BLUETOOTH® low energy connectivity of captured image and sensor data to the mobile app. This app provides developers access to a variety of features including cloud connectivity, remote configuration of sensors, and changes in the image capture trigger modes.

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