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THSF-ID7-B

Name: ADLINK Technology THSF-ID7-B
Brand: ADLINK Technology
SKU: 976-THSF-ID7-B
Price: 1932935 IDR
Availability: OutOfStock

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Mouser No:

976-THSF-ID7-B

Mfr. No:

THSF-ID7-B

Mfr.:

ADLINK Technology

Description:

Heat Sinks High profile heatsink with fan for Express-ID7 with threaded standoffs

Datasheet:

THSF-ID7-B Datasheet

ECAD Model:

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More Information

Learn more about ADLINK Technology THSF-ID7-B

Availability

Stock:: 0

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Factory Lead Time:: 18 Weeks Estimated factory production time.

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Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp1.932.935	Rp1.932.935
	Rp1.778.645	Rp17.786.450
	Rp1.659.946	Rp41.498.650
	Rp1.600.689	Rp80.034.450
	Rp1.541.798	Rp154.179.800
250	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	ADLINK Technology
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Brand:	ADLINK Technology
Product Type:	Heat Sinks
Factory Pack Quantity:	1
Subcategory:	Heat Sinks
Type:	High Profile Heatsink

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Datasheet

THSF-ID7-B Datasheet

CAHTS:: 8473309000
USHTS:: 8473305100
JPHTS:: 847330090
MXHTS:: 8473300499
ECCN:: EAR99

Express-ID7 Module

ADLINK Technology Express-ID7 Module is powered by the Intel® Xeon® D-1700 processor and offers integrated high-speed Ethernet (up to 4x 10G). The ADLINK Technology Express-ID7 also features 16 PCIe Gen4 lanes for immediate responsiveness. The device incorporates Intel® technologies like TCC, Deep Learning Boost (VNNI), and AVX-512 for accelerated AI performance. The Express-ID7 supports Time Sensitive Networking (TSN) for precisely controlling real-time workloads across networked devices. This rugged and edge AI-focused COM, featuring Intel® Ice Lake-D, empowers system integrators for diverse applications, including edge networking, robotics, autonomous driving, 5G, and more.