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ATS-51230R-C1-R0

Name: Advanced Thermal Solutions ATS-51230R-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-51230R-C1-R0
Price: 248221 IDR
Availability: InStock

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Mouser No:

984-ATS-51230R-C1-R0

Mfr. No:

ATS-51230R-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW BGA Heat Sink+maxiGRIP Attachment, T766, 23x23x19.5mm, 41.5mm Fin Tip

Datasheet:

ATS-51230R-C1-R0 Datasheet (PDF)

ECAD Model:

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Learn more about Advanced Thermal Solutions ATS-51230R-C1-R0

In Stock: 308

Stock:: 308 Can Dispatch Immediately

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Factory Lead Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp248.221	Rp248.221
	Rp233.545	Rp2.335.450
	Rp228.408	Rp4.568.160
	Rp224.739	Rp11.236.950
	Rp221.803	Rp22.180.300
	Rp220.152	Rp110.076.000
	Rp218.868	Rp218.868.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	BGA
Mounting Style:	Snap On
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	4.98 C/W
Length:	23 mm
Width:	23 mm
Height:	19.5 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	maxiGRIP HS ASM
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW maxiGRIP
Type:	Component
Unit Weight:	10,600 g

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Datasheet

ATS-51230R-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 8548000090
USHTS:: 8542900000
TARIC:: 7616991099
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.