Data Centre Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

Results: 199
Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Type Package/Case Material Thermal Conductivity Breakdown Voltage Color Minimum Operating Temperature Maximum Operating Temperature Length Width Thickness Tensile Strength Flammability Rating Series Packaging
Bergquist Company 2763110
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 3041247
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

TGP 10000ULM
Bergquist Company 3041248
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

TGP 10000ULM
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, 400CC Kit, IDH 2550920, 2166520 Lead-Time 8 Weeks
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Silicone Elastomer 3.6 W/m-K Blue - 60 C + 200 C UL 94 V-0 3500S35 / TGF 3600
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 1 Gallon Pail, 6 W/m-K, Liqui-Form Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1 Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 2.54 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Material, 150CC, 3.5 W/m-K, Liqui-Form Non-Stocked Lead-Time 16 Weeks
Min.: 6
Mult.: 1
Thermal Interface Materials Liquid Form 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 1 Gallon, 6.0 W/m-K, Liqui-Form TLF 6000HG Non-Stocked Lead-Time 13 Weeks
Min.: 1
Mult.: 1
Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM Non-Stocked Lead-Time 19 Weeks
Min.: 438
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 1.016 mm 4 psi UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 180ml Cartridge, 6 W/m-K, Liqui-Form
Non-Stocked Lead-Time 16 Weeks
Min.: 10
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material TLF 6000HG
Bergquist Company Thermal Interface Products Liquid Gap Filler, 200CC Dual Cartridge, Gap Filler TGF 1500/1500, IDH 2233096 Non-Stocked Lead-Time 16 Weeks
Min.: 11
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Non-standard Silicone Elastomer 1.8 W/m-K Yellow, White - 60 C + 200 C UL 94 V-0 1500 / TGF 1500
Bergquist Company Thermal Interface Products Non-Stocked Lead-Time 16 Weeks
Min.: 11
Mult.: 1

Non-standard 300G / THF 1600G
Bergquist Company Thermal Interface Products Liquid Epoxy Adhesive, 2-Part, 200CC Dual Cartridge, Liqui-Bond TLBEA1800/EA1805 Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

Thermally Conductive Adhesives Thermal Conductive Gel Paste Epoxy 1.8 W/m-K Gray, Yellow - 40 C + 125 C 450 psi UL 94 V-0 EA 1805 / TLB EA1800
Bergquist Company Thermal Interface Products Liquid Silicon Adhesive, 1-Part, 50CC Dual Cartridge, LIQUI-BOND TLBSA3500 Non-Stocked Lead-Time 16 Weeks
Min.: 10
Mult.: 1

Thermally Conductive Adhesives Silicone Elastomer Brown - 60 C + 200 C UL 94 V-0 SA 3505 / TLB SA3500
Bergquist Company 2605474
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Non-Stocked Lead-Time 8 Weeks
Min.: 80
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-8G FLEX
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Non-Stocked Lead-Time 8 Weeks
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2624538
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K, KG, Liqui-Form TLF 6000HG Non-Stocked Lead-Time 8 Weeks
Min.: 833.334
Mult.: 1

TLF 6000HG
Bergquist Company TLF600HG00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Non-Stocked Lead-Time 8 Weeks
Min.: 3
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Non-Stocked Lead-Time 8 Weeks
Min.: 2.871
Mult.: 1

TLF 6000HG
Bergquist Company 2763096
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 6.0 W/m-K, Liqui-Form TLF 6000HG Non-Stocked Lead-Time 8 Weeks
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2746333
Bergquist Company Thermal Interface Products GAP PAD, Conductive, Reinforced, Soft S-Class Gap Fill, 3.0 W/m-K Non-Stocked Lead-Time 15 Weeks
Min.: 9
Mult.: 1

3000ULM / TGP 3000ULM