Server Applications

Bergquist Company Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Bergquist Company offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.

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Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Type
Package/Case
Material
Thermal Conductivity
Breakdown Voltage
Color
Minimum Operating Temperature
Maximum Operating Temperature
Length
Width
Thickness
Tensile Strength
Flammability Rating
Series
Packaging
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM
Datasheet
Non-Stocked Lead-Time 19 Weeks
Min.: 438
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 1.016 mm 4 psi UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 180ml Cartridge, 6 W/m-K, Liqui-Form
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 10
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material TLF 6000HG
Bergquist Company Thermal Interface Products
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 11
Mult.: 1

Non-standard 300G / THF 1600G
Bergquist Company 2605474
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 80
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-8G FLEX
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2624538
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K, KG, Liqui-Form TLF 6000HG
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 833.334
Mult.: 1

TLF 6000HG
Bergquist Company TLF600HG00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 3
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 2.871
Mult.: 1

TLF 6000HG
Bergquist Company 2763096
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 6.0 W/m-K, Liqui-Form TLF 6000HG
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2746333
Bergquist Company Thermal Interface Products GAP PAD, Conductive, Reinforced, Soft S-Class Gap Fill, 3.0 W/m-K
Datasheet
Non-Stocked Lead-Time 15 Weeks
Min.: 9
Mult.: 1

3000ULM / TGP 3000ULM