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FF1800R23IE7PBPSA1

Name: Infineon FF1800R23IE7PBPSA1
Brand: Infineon Technologies
SKU: 726-FF1800R23IE7PBPS
Price: 24458887 IDR
Availability: OutOfStock

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Mouser No:

726-FF1800R23IE7PBPS

Mfr. No:

FF1800R23IE7PBPSA1

Mfr.:

Infineon Technologies

Description:

IGBT Modules PP IHM I

Datasheet:

FF1800R23IE7PBPSA1 Datasheet (PDF)

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This product may require additional documentation to export from the United States.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	IGBT Modules
Delivery Restrictions:	This product may require additional documentation to export from the United States.
RoHS:
Technology:	Si
Packaging:	Tray
Brand:	Infineon Technologies
Product Type:	IGBT Modules
Series:	FFXR23IX7F
Factory Pack Quantity:	3
Subcategory:	Discrete and Power Modules
Part # Aliases:	FF1800R23IE7P SP005678645

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Datasheet

FF1800R23IE7PBPSA1 Datasheet (PDF)

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Compliance Codes

CAHTS:: 8541290000
USHTS:: 8541290065
JPHTS:: 854129000
TARIC:: 8541290000
MXHTS:: 8541299900
ECCN:: 3A228.c

Origin Classifications

Country of Origin:: Austria
Assembly Country of Origin:: Germany
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

IGBT7 E7 TRENCHSTOP™ Dual Configuration Modules

Infineon Technologies IGBT7 E7 TRENCHSTOP™ Dual Configuration Modules are based on micro-pattern trench technology that reduces losses and offers high controllability. The cell concept is characterized by implementing parallel trench cells separated by sub-micron mesas in contrast to square trench cells. A specially optimized chip for industrial drive applications and solar energy systems provides low static losses, high power density, and soft switching. With a +175°C maximum operating temperature, the modules allow a significant increase in power density.

FF1800R23IE7 PrimePACK™3+ B-Series Modules

Infineon Technologies FF1800R23IE7 PrimePACK™3+ B-Series Modules feature TRENCHSTOP™ IGBT7 technology. The Infineon modules have an emitter-controlled 7-diode and NTC/pre-applied thermal interface material. According to IEC 60747, 60749, and 60068 compliance, the device is qualified for industrial applications.