|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-2-K-TR
- Samtec
-
1:
Rp501.947
-
380In Stock
|
Mouser Part No
200-LPAM40015L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
380In Stock
|
|
|
Rp501.947
|
|
|
Rp426.545
|
|
|
Rp399.576
|
|
|
Rp395.907
|
|
|
Rp395.540
|
|
|
Rp342.887
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-2-K-TR
- Samtec
-
1:
Rp278.125
-
191In Stock
|
Mouser Part No
200-LPAM30015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
191In Stock
|
|
|
Rp278.125
|
|
|
Rp264.916
|
|
|
Rp260.330
|
|
|
Rp256.844
|
|
|
Rp212.263
|
|
|
View
|
|
|
Rp255.743
|
|
|
Rp208.777
|
|
|
Rp205.108
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
180 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-08-2-K-TR
- Samtec
-
1:
Rp593.677
-
343In Stock
|
Mouser Part No
200-LPAM40015S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
343In Stock
|
|
|
Rp593.677
|
|
|
Rp504.515
|
|
|
Rp472.776
|
|
|
Rp465.438
|
|
|
View
|
|
|
Rp434.800
|
|
|
Rp438.836
|
|
|
Rp434.800
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp296.471
-
134In Stock
|
Mouser Part No
200-LPAM30010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
134In Stock
|
|
|
Rp296.471
|
|
|
Rp273.722
|
|
|
Rp265.650
|
|
|
Rp257.578
|
|
|
Rp207.493
|
|
|
View
|
|
|
Rp252.624
|
|
|
Rp206.209
|
|
|
Rp203.274
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
Headers
|
180 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-2-K-TR
- Samtec
-
1:
Rp586.705
-
439In Stock
|
Mouser Part No
200-LPAM40010S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
439In Stock
|
|
|
Rp586.705
|
|
|
Rp531.484
|
|
|
Rp510.019
|
|
|
Rp506.350
|
|
|
Rp363.985
|
|
|
View
|
|
|
Rp373.341
|
|
|
Rp357.930
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-L-08-1-K-TR
- Samtec
-
1:
Rp685.773
-
139In Stock
|
Mouser Part No
200-LPAM50010L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
139In Stock
|
|
|
Rp685.773
|
|
|
Rp655.686
|
|
|
Rp631.102
|
|
|
Rp584.870
|
|
|
View
|
|
|
Rp456.815
|
|
|
Rp502.497
|
|
|
Rp456.815
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Samtec LPAM-30-01.0-S-06-1-K-TR
- LPAM-30-01.0-S-06-1-K-TR
- Samtec
-
1:
Rp443.239
-
275In Stock
-
New Product
|
Mouser Part No
200-LPAM30010S061KTR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
275In Stock
|
|
|
Rp443.239
|
|
|
Rp332.796
|
|
|
Rp332.613
|
|
|
Rp311.882
|
|
|
View
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-04-2-K-TR
- Samtec
-
1:
Rp252.074
-
203In Stock
|
Mouser Part No
200-LPAM20010L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
203In Stock
|
|
|
Rp252.074
|
|
|
Rp238.865
|
|
|
Rp229.692
|
|
|
Rp212.997
|
|
|
Rp145.851
|
|
|
View
|
|
|
Rp183.093
|
|
|
Rp182.176
|
|
|
Rp137.595
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
475
|
|
|
Headers
|
80 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Solder
|
Straight
|
|
2.2 A
|
250 VAC
|
|
|
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp289.683
-
162In Stock
|
Mouser Part No
200-LPAM20010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
162In Stock
|
|
|
Rp289.683
|
|
|
Rp246.203
|
|
|
Rp230.793
|
|
|
Rp219.785
|
|
|
Rp174.654
|
|
|
View
|
|
|
Rp212.447
|
|
|
Rp164.380
|
|
|
Rp154.657
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-06-1-K-TR
- Samtec
-
1:
Rp303.259
-
175In Stock
|
Mouser Part No
200-LPAM20015L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
175In Stock
|
|
|
Rp303.259
|
|
|
Rp289.867
|
|
|
Rp279.043
|
|
|
Rp258.495
|
|
|
Rp202.540
|
|
|
View
|
|
|
Rp222.170
|
|
|
Rp192.266
|
|
|
Rp186.579
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-06-2-K-TR
- Samtec
-
1:
Rp295.187
-
232In Stock
|
Mouser Part No
200-LPAM20015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
232In Stock
|
|
|
Rp295.187
|
|
|
Rp250.973
|
|
|
Rp235.379
|
|
|
Rp224.005
|
|
|
Rp178.323
|
|
|
View
|
|
|
Rp222.354
|
|
|
Rp168.600
|
|
|
Rp168.416
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-04-2-K-TR
- Samtec
-
1:
Rp289.500
-
160In Stock
|
Mouser Part No
200-LPAM30010L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
160In Stock
|
|
|
Rp289.500
|
|
|
Rp246.203
|
|
|
Rp230.793
|
|
|
Rp219.785
|
|
|
Rp173.553
|
|
|
View
|
|
|
Rp212.263
|
|
|
Rp211.162
|
|
|
Rp155.391
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
475
|
|
|
Plugs
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Straight
|
|
2.2 A
|
250 VAC
|
|
|
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp529.832
-
149In Stock
|
Mouser Part No
200-LPAM40010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
149In Stock
|
|
|
Rp529.832
|
|
|
Rp450.394
|
|
|
Rp422.141
|
|
|
Rp411.317
|
|
|
Rp337.933
|
|
|
Rp335.915
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-06-2-K-TR
- Samtec
-
1:
Rp460.118
-
607In Stock
|
Mouser Part No
200-LPAM40015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
607In Stock
|
|
|
Rp460.118
|
|
|
Rp439.937
|
|
|
Rp423.426
|
|
|
Rp392.421
|
|
|
View
|
|
|
Rp337.933
|
|
|
Rp338.117
|
|
|
Rp337.933
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp491.122
-
113In Stock
-
300Expected 28/10/2026
|
Mouser Part No
200-LPAM50010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
113In Stock
300Expected 28/10/2026
|
|
|
Rp491.122
|
|
|
Rp457.916
|
|
|
Rp457.916
|
|
|
Rp359.215
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
400 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-04-2-K-TR
- Samtec
-
1:
Rp252.074
-
120In Stock
|
Mouser Part No
200-LPAM20015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
120In Stock
|
|
|
Rp252.074
|
|
|
Rp214.281
|
|
|
Rp200.889
|
|
|
Rp191.165
|
|
|
Rp148.970
|
|
|
View
|
|
|
Rp182.543
|
|
|
Rp178.874
|
|
|
Rp133.559
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
450
|
|
|
Headers
|
80 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-2-K-TR
- Samtec
-
1:
Rp405.447
-
2In Stock
|
Mouser Part No
200-LPAM20015S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
2In Stock
|
|
|
Rp405.447
|
|
|
Rp344.721
|
|
|
Rp323.073
|
|
|
Rp307.662
|
|
|
Rp250.606
|
|
|
View
|
|
|
Rp306.929
|
|
|
Rp238.681
|
|
|
Rp232.627
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
160 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-04-1-K-TR
- Samtec
-
1:
Rp297.022
-
353In Stock
|
Mouser Part No
200-LPAM30010L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
353In Stock
|
|
|
Rp297.022
|
|
|
Rp283.996
|
|
|
Rp273.355
|
|
|
Rp253.542
|
|
|
Rp200.522
|
|
|
View
|
|
|
Rp217.767
|
|
|
Rp204.558
|
|
|
Rp186.395
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
475
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-2-K-TR
- Samtec
-
1:
Rp303.259
-
18In Stock
|
Mouser Part No
200-LPAM30015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
18In Stock
|
|
|
Rp303.259
|
|
|
Rp289.867
|
|
|
Rp272.988
|
|
|
Rp252.991
|
|
|
Rp188.047
|
|
|
View
|
|
|
Rp217.400
|
|
|
Rp188.230
|
|
|
Rp173.370
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
450
|
|
|
Headers
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp423.976
-
18In Stock
|
Mouser Part No
200-LPAM40010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
18In Stock
|
|
|
Rp423.976
|
|
|
Rp360.499
|
|
|
Rp337.933
|
|
|
Rp322.339
|
|
|
Rp264.733
|
|
|
View
|
|
|
Rp322.156
|
|
|
Rp252.258
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-1-K-TR
- Samtec
-
1:
Rp190.798
-
573Expected 13/10/2026
|
Mouser Part No
200-LPAM10010L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
573Expected 13/10/2026
|
|
|
Rp190.798
|
|
|
Rp178.140
|
|
|
Rp168.416
|
|
|
Rp154.290
|
|
|
Rp127.138
|
|
|
View
|
|
|
Rp132.458
|
|
|
Rp124.202
|
|
Min.: 1
Mult.: 1
:
625
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-2-K-TR
- Samtec
-
1:
Rp163.646
-
1.220Expected 02/11/2026
|
Mouser Part No
200-LPAM10010L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
1.220Expected 02/11/2026
|
|
|
Rp163.646
|
|
|
Rp139.063
|
|
|
Rp130.440
|
|
|
Rp124.202
|
|
|
Rp106.223
|
|
|
View
|
|
|
Rp118.148
|
|
|
Rp113.745
|
|
|
Rp92.831
|
|
Min.: 1
Mult.: 1
:
625
|
|
|
Headers
|
40 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp423.976
-
293Expected 11/11/2026
|
Mouser Part No
200-LPAM30010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
293Expected 11/11/2026
|
|
|
Rp423.976
|
|
|
Rp360.315
|
|
|
Rp337.750
|
|
|
Rp322.339
|
|
|
Rp264.916
|
|
|
View
|
|
|
Rp322.156
|
|
|
Rp263.265
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-1-K-TR
- Samtec
-
1:
Rp357.197
-
258Expected 09/11/2026
|
Mouser Part No
200-LPAM30015L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
258Expected 09/11/2026
|
|
|
Rp357.197
|
|
|
Rp341.236
|
|
|
Rp329.494
|
|
|
Rp316.102
|
|
|
Rp228.408
|
|
|
View
|
|
|
Rp249.689
|
|
|
Rp227.857
|
|
|
Rp227.674
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-1-K-FR
- Samtec
-
625:
Rp112.094
-
Non-Stocked Lead-Time 11 Weeks
|
Mouser Part No
200-LPAM10010L041KFR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 11 Weeks
|
|
|
Rp112.094
|
|
|
Rp82.740
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 625
Mult.: 625
:
625
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|