|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-2-K-TR
- Samtec
-
1:
Rp581.201
-
447In Stock
|
Mouser Part No
200-LPAM40010S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
447In Stock
|
|
|
Rp581.201
|
|
|
Rp479.931
|
|
|
Rp458.283
|
|
|
Rp456.815
|
|
|
View
|
|
|
Rp397.925
|
|
|
Rp456.632
|
|
|
Rp397.925
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-06-2-K-TR
- Samtec
-
1:
Rp460.118
-
607In Stock
|
Mouser Part No
200-LPAM40015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
607In Stock
|
|
|
Rp460.118
|
|
|
Rp439.937
|
|
|
Rp423.426
|
|
|
Rp392.421
|
|
|
View
|
|
|
Rp337.933
|
|
|
Rp337.933
|
|
|
Rp337.933
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp491.122
-
328In Stock
|
Mouser Part No
200-LPAM50010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
328In Stock
|
|
|
Rp491.122
|
|
|
Rp457.916
|
|
|
Rp457.916
|
|
|
Rp354.078
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
400 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.0-L-08-2-K-TR
- Samtec
-
1:
Rp391.871
-
35In Stock
|
Mouser Part No
200-LPAF30030L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
35In Stock
|
|
|
Rp391.871
|
|
|
Rp332.796
|
|
|
Rp311.882
|
|
|
Rp298.856
|
|
|
Rp244.552
|
|
|
View
|
|
|
Rp298.123
|
|
|
Rp234.462
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
350
|
|
|
Sockets
|
240 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-08-2-K-TR
- Samtec
-
1:
Rp501.396
-
9In Stock
-
325Expected 07/09/2026
|
Mouser Part No
200-LPAF40035L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
9In Stock
325Expected 07/09/2026
|
|
|
Rp501.396
|
|
|
Rp426.178
|
|
|
Rp399.576
|
|
|
Rp387.101
|
|
|
Rp318.303
|
|
|
Rp316.102
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
Sockets
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.5-L-08-2-K-TR
- Samtec
-
1:
Rp645.963
-
319In Stock
|
Mouser Part No
200-LPAF50035L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
319In Stock
|
|
|
Rp645.963
|
|
|
Rp617.526
|
|
|
Rp594.410
|
|
|
Rp550.930
|
|
|
View
|
|
|
Rp443.973
|
|
|
Rp473.327
|
|
|
Rp443.973
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-04-2-K-TR
- Samtec
-
1:
Rp252.074
-
120In Stock
|
Mouser Part No
200-LPAM20015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
120In Stock
|
|
|
Rp252.074
|
|
|
Rp214.281
|
|
|
Rp200.889
|
|
|
Rp191.165
|
|
|
Rp148.970
|
|
|
View
|
|
|
Rp182.543
|
|
|
Rp175.938
|
|
|
Rp134.660
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
450
|
|
|
Headers
|
80 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-2-K-TR
- Samtec
-
1:
Rp405.447
-
2In Stock
|
Mouser Part No
200-LPAM20015S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
2In Stock
|
|
|
Rp405.447
|
|
|
Rp344.721
|
|
|
Rp323.073
|
|
|
Rp307.662
|
|
|
Rp250.606
|
|
|
View
|
|
|
Rp306.929
|
|
|
Rp238.681
|
|
|
Rp232.627
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
160 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-04-1-K-TR
- Samtec
-
1:
Rp297.022
-
353In Stock
|
Mouser Part No
200-LPAM30010L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
353In Stock
|
|
|
Rp297.022
|
|
|
Rp283.996
|
|
|
Rp273.355
|
|
|
Rp253.542
|
|
|
Rp200.522
|
|
|
View
|
|
|
Rp217.767
|
|
|
Rp204.558
|
|
|
Rp186.395
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
475
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-2-K-TR
- Samtec
-
1:
Rp303.259
-
18In Stock
|
Mouser Part No
200-LPAM30015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
18In Stock
|
|
|
Rp303.259
|
|
|
Rp289.867
|
|
|
Rp274.273
|
|
|
Rp254.092
|
|
|
Rp188.413
|
|
|
View
|
|
|
Rp218.317
|
|
|
Rp188.597
|
|
|
Rp173.370
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
450
|
|
|
Headers
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp423.976
-
18In Stock
|
Mouser Part No
200-LPAM40010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
18In Stock
|
|
|
Rp423.976
|
|
|
Rp360.499
|
|
|
Rp337.933
|
|
|
Rp322.339
|
|
|
Rp264.733
|
|
|
View
|
|
|
Rp322.156
|
|
|
Rp252.258
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-L-08-1-K-TR
- Samtec
-
1:
Rp685.773
-
139In Stock
|
Mouser Part No
200-LPAM50010L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
139In Stock
|
|
|
Rp685.773
|
|
|
Rp655.686
|
|
|
Rp631.102
|
|
|
Rp584.870
|
|
|
View
|
|
|
Rp456.815
|
|
|
Rp502.313
|
|
|
Rp456.815
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-L-08-2-K-TR
- Samtec
-
1:
Rp700.267
-
251In Stock
|
Mouser Part No
200-LPAM50015L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
251In Stock
|
|
|
Rp700.267
|
|
|
Rp669.446
|
|
|
Rp644.312
|
|
|
Rp597.162
|
|
|
View
|
|
|
Rp481.216
|
|
|
Rp512.954
|
|
|
Rp481.216
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-L-08-2-K-TR
- Samtec
-
1:
Rp579.367
-
319Expected 19/08/2026
|
Mouser Part No
200-LPAF50030L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
319Expected 19/08/2026
|
|
|
Rp579.367
|
|
|
Rp492.590
|
|
|
Rp461.769
|
|
|
Rp453.513
|
|
|
Rp372.791
|
|
Min.: 1
Mult.: 1
:
350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-1-K-TR
- Samtec
-
1:
Rp357.197
-
258Expected 09/11/2026
|
Mouser Part No
200-LPAM30015L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
258Expected 09/11/2026
|
|
|
Rp357.197
|
|
|
Rp341.236
|
|
|
Rp329.494
|
|
|
Rp316.102
|
|
|
Rp228.408
|
|
|
View
|
|
|
Rp249.689
|
|
|
Rp227.857
|
|
|
Rp227.674
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.0-L-04-1-K-TR
- Samtec
-
700:
Rp113.745
-
Non-Stocked Lead-Time 2 Weeks
|
Mouser Part No
200-LPAF10030L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 2 Weeks
|
|
|
Rp113.745
|
|
|
Rp110.810
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 700
Mult.: 700
:
700
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.0-L-06-1-K-TR
- Samtec
-
700:
Rp139.613
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF10030L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp139.613
|
|
|
Rp136.678
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 700
Mult.: 700
:
700
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.0-L-06-2-K-TR
- Samtec
-
700:
Rp118.515
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF10030L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp118.515
|
|
|
Rp111.911
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 700
Mult.: 700
:
700
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.0-L-08-2-K-TR
- Samtec
-
475:
Rp166.398
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF10030L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp166.398
|
|
|
Rp154.840
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 475
Mult.: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.0-S-04-1-K-TR
- Samtec
-
700:
Rp127.505
-
Non-Stocked Lead-Time 7 Weeks
|
Mouser Part No
200-LPAF10030S041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 7 Weeks
|
|
|
Rp127.505
|
|
|
Rp124.019
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 700
Mult.: 700
:
700
|
|
|
Sockets
|
40 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.0-S-04-2-K-TR
- Samtec
-
700:
Rp127.505
-
Non-Stocked Lead-Time 7 Weeks
|
Mouser Part No
200-LPAF10030S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 7 Weeks
|
|
|
Rp127.505
|
|
|
Rp124.019
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 700
Mult.: 700
:
700
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.0-S-06-1-K-TR
- Samtec
-
700:
Rp155.024
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF10030S061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp155.024
|
|
|
Rp151.538
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 700
Mult.: 700
:
700
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD ARRAY
- LPAF-10-03.0-S-06-2-K-TR
- Samtec
-
700:
Rp158.693
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF10030S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD ARRAY
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
Min.: 700
Mult.: 700
:
700
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-L-04-2-K-TR
- Samtec
-
1:
Rp174.104
-
Non-Stocked Lead-Time 7 Weeks
|
Mouser Part No
200-LPAF10035L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 7 Weeks
|
|
|
Rp174.104
|
|
|
Rp148.052
|
|
|
Rp138.696
|
|
|
Rp132.091
|
|
|
Rp99.252
|
|
|
View
|
|
|
Rp125.670
|
|
|
Rp117.231
|
|
|
Rp93.565
|
|
|
Rp87.327
|
|
Min.: 1
Mult.: 1
:
650
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-L-06-1-K-TR
- Samtec
-
650:
Rp142.365
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
200-LPAF10035L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
|
Rp142.365
|
|
|
Rp139.246
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 650
Mult.: 650
:
650
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|