|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-L-04-1-K-TR
- Samtec
-
500:
Rp169.334
-
Non-Stocked Lead-Time 7 Weeks
|
Mouser Part No
200-LPAF30035L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 7 Weeks
|
|
|
Rp169.334
|
|
|
Rp164.931
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-L-06-1-K-TR
- Samtec
-
500:
Rp197.586
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF30035L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp197.586
|
|
|
Rp197.220
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-L-08-1-K-TR
- Samtec
-
325:
Rp298.489
-
Non-Stocked Lead-Time 7 Weeks
|
Mouser Part No
200-LPAF30035L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 7 Weeks
|
|
|
Rp298.489
|
|
|
Rp291.885
|
|
|
View
|
|
|
Quote
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-L-08-2-K-TR
- Samtec
-
325:
Rp289.316
-
Non-Stocked Lead-Time 7 Weeks
|
Mouser Part No
200-LPAF30035L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 7 Weeks
|
|
|
Rp289.316
|
|
|
Rp278.492
|
|
|
View
|
|
|
Quote
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-S-04-2-K-TR
- Samtec
-
500:
Rp196.302
-
Non-Stocked Lead-Time 7 Weeks
|
Mouser Part No
200-LPAF30035S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 7 Weeks
|
|
|
Rp196.302
|
|
|
Rp184.377
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-S-06-2-K-TR
- Samtec
-
500:
Rp227.307
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF30035S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-S-08-1-K-TR
- Samtec
-
325:
Rp331.696
-
Non-Stocked Lead-Time 7 Weeks
|
Mouser Part No
200-LPAF30035S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 7 Weeks
|
|
|
Rp331.696
|
|
|
Rp324.357
|
|
|
View
|
|
|
Quote
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-04-2-K-TR
- Samtec
-
550:
Rp215.566
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF40030L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
Min.: 550
Mult.: 550
:
550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-06-1-K-TR
- Samtec
-
550:
Rp260.330
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF40030L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
Min.: 550
Mult.: 550
:
550
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-08-1-K-TR
- Samtec
-
1:
Rp531.484
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF40030L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp531.484
|
|
|
Rp508.184
|
|
|
Rp489.104
|
|
|
Rp453.330
|
|
|
View
|
|
|
Rp342.520
|
|
|
Rp389.486
|
|
|
Rp342.520
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
350
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-S-06-2-K-TR
- Samtec
-
550:
Rp284.363
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF40030S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
Min.: 550
Mult.: 550
:
550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-04-1-K-TR
- Samtec
-
500:
Rp219.602
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF40035L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp219.602
|
|
|
Rp215.015
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-04-2-K-TR
- Samtec
-
500:
Rp208.777
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF40035L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp208.777
|
|
|
Rp198.871
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-06-2-K-TR
- Samtec
-
500:
Rp256.844
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF40035L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-08-1-K-TR
- Samtec
-
325:
Rp367.654
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF40035L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-S-04-1-K-TR
- Samtec
-
500:
Rp244.002
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF40035S041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-S-04-2-K-TR
- Samtec
-
500:
Rp312.065
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF40035S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-S-08-1-K-TR
- Samtec
-
325:
Rp427.829
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF40035S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-L-08-1-K-TR
- Samtec
-
350:
Rp445.808
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF50030L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
Min.: 350
Mult.: 350
:
350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-S-08-1-K-TR
- Samtec
-
350:
Rp484.151
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF50030S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
Min.: 350
Mult.: 350
:
350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-S-08-2-K-TR
- Samtec
-
350:
Rp494.425
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF50030S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
Min.: 350
Mult.: 350
:
350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.5-S-08-1-K-TR
- Samtec
-
325:
Rp504.698
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF50035S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.5-S-08-2-K-TR
- Samtec
-
325:
Rp607.620
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF50035S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-1-K-TR
- Samtec
-
625:
Rp127.138
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM10010L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp127.138
|
|
|
Rp124.202
|
|
Min.: 625
Mult.: 625
:
625
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-06-1-K-TR
- Samtec
-
400:
Rp171.168
-
Non-Stocked Lead-Time 9 Weeks
|
Mouser Part No
200-LPAM10010L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 9 Weeks
|
|
|
Rp171.168
|
|
|
Rp169.517
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
|
|
|
|
|
|
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LPAM
|
Reel
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