ADLINK Technology Embedded Solutions

Results: 1.473
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ADLINK Technology AmITX-CF-I-H310
ADLINK Technology Single Board Computers AmITX-CF-I-H310Mini-ITX for Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with H310 ChipsetBIOS ver. 1.01.10
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AmITX-CF-I-Q370
ADLINK Technology Single Board Computers AmITX-CF-I-Q370BIOS Rev. 1.01.10Mini-ITX for Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AmITX-RL-I
ADLINK Technology Industrial Motherboards AmITX-RL-I Mini-ITX Embedded Motherboard, Intel 12/13/14th Core-I, Q670, DDR5, 1xPCIe
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AmITX-RZ-G-R2314
ADLINK Technology Single Board Computers 2x DDR4 SODIMM vertical socketsPCIe x16 Slot (x8 Lanes)PCIe x1 SlotM.2 M Key Socket (x2 Lanes)mPCIe CONN (mSATA)2x SATA CONN2x GLAN CONN6x USB 2.0 Port ; 4x USB 3.0 Port6x COM Port7.1 audio CH
Datasheet
Non-Stocked Lead-Time 28 Weeks
Min.: 1
Mult.: 1
ADLINK Technology AmITX-RZ-G-R2544
ADLINK Technology Single Board Computers 2x DDR4 SODIMM vertical socketsPCIe x16 Slot (x8 Lanes)PCIe x1 SlotM.2 M Key Socket (x2 Lanes)mPCIe CONN (mSATA)2x SATA CONN2x GLAN CONN6x USB 2.0 Port ; 4x USB 3.0 Port6x COM Port7.1 audio CH
Datasheet
Non-Stocked Lead-Time 28 Weeks
Min.: 1
Mult.: 1
ADLINK Technology AmITX-RZ-G-R1505G
ADLINK Technology Single Board Computers RYZEN R1505G APU2x DDR4 SODIMM vertical sockets PCIe x16 Slot(x4 Lanes) & x1 Slot3x DP 1.2M.2 M Key Socket(x2 Lanes) 2x SATA & 1x GLAN CONN6x USB 2.0 & 4x USB 3.0 Port6x COM Port7.1 audio CH
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AmITX-RZ-G-R1606G
ADLINK Technology Single Board Computers RYZEN R1606G APU2x DDR4 SODIMM vertical sockets PCIe x16 Slot(x4 Lanes) & x1 Slot3x DP 1.2M.2 M Key Socket(x2 Lanes) 2x SATA & 1x GLAN CONN6x USB 2.0 & 4x USB 3.0 Port6x COM Port7.1 audio CH
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AMSTX-CFP12-H310
ADLINK Technology Single Board Computers Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with H310 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B key, with PCIex1 edge connector, WO/AMP for speaker-out, WO/TPM, WO/LVDS
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AMSTX-CFP12-Q370
ADLINK Technology Single Board Computers Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B/M key, with PCIex4 edge connector, WO/AMP for speaker-out, WO/TPM, WO/LVDS
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AmSTX-CF Cooler Pizza BOX
ADLINK Technology Enclosures for Single Board Computing Size:282x249x138mm;Outer facing: A case, 230g/m2;Medium Paper: 100g/m2;Pressure: 14kgf/cm2 Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AMSTX-CF CPU Backing Plate
ADLINK Technology Enclosures for Single Board Computing 1.32-50015-0100-A02.Retention, Material=SPCC t=2.0mm,Extrude M3.0xP0.503.Mylar with adhesive4.Backplate_75x75mm5.nut step=6.0mm Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AmSTX-CF Large EPE Bottom
ADLINK Technology Enclosures for Single Board Computing Size: 256x243x81mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: Pink.ESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AmSTX-CF Large EPE Top
ADLINK Technology Enclosures for Single Board Computing Size: 256x243x50mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: PinkESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AMSTX-CFP12-Q370, AMP/TPM/LVDS
ADLINK Technology Single Board Computers Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B/M key, with PCIex4 edge connector, W/AMP for speaker-out, W/TPM, W/LVDS
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology Anise re-spin sample kit
ADLINK Technology Industrial Motherboards Anise re-spin sample kit with MB , I5 CPU , Heatsink , 8GB Memory Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology Type-C Hub& Adapter Kit JCDP38
ADLINK Technology USB Hubs USB Type-C Hub JCDP385-1T,HDMI 4K, USB3.1x2, SD Card slot, PD 2.0 max 35W, AC adapter 45W, Power cord US+EU Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AVA-3510-Gen1
ADLINK Technology Industrial Box PCs AVA-3510 Gen 1 with top Fan,Xeon 2278 GE, DDR4 64G ECC, RTX-5000,2.5" SSD 256G x1, Ignition, DC 9-36V
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AVA-5510/7820/32G/A2000/DIO
ADLINK Technology Video Modules Fan-less railway computer with Intel Core i7-7820EQ, 32GB DDR4 RAM, 4x SATA slots, EGX-MXM-A2000 integrated, and 4x DIO board
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology AVA-RAGXI/NPOE,CC
ADLINK Technology Video Modules AI Video Analytics with NVIDIA Jetson AGX Xavier industrial, 32GB LPDDR4, 64GB EMMC supporting 4x M12 ETH, 2x USB 3.1, 4x DI/DO, 2x CAN and 1x COM, conformal coating
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

ADLINK Technology AXE-7400SR
ADLINK Technology Rack Mount / Server PCs AXE-7400SR/ MB w2x10G/ Xeon Gold 5423N*1/DDR5 16GB*4/256G M.2*1/ AC1600W *1/ no slides
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology BACKPLATE SIZE 92.45X89X10.7MM
ADLINK Technology Modules Accessories Retention,Material=SPCC, T=2.0mm,Nut Pitch=M3x0.5,Holes Distance=75x75,Nut H.=2.7/6Include:Mylar with adhesive Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology Backplate Size_53x53x3.2mm
ADLINK Technology Modules Accessories Retention,Material=SPCC, T=1.8mm,Nut Pitch=M2x0.4,Holes Distance=46x46,Nut H.=1.4Include:Mylar(S10) with adhesive Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology Backplate size_92.5x89x6.3mm
ADLINK Technology Modules Accessories 1. 32-50031-0000-A02. Backing plate for INTEL 115X socket CPU3. Mylar with adhesive4. Backplate: 75x75mm5. Material: SPCC Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology CANBUS M.2 B M MODULE
ADLINK Technology Interface Modules M.2(B+M) to Single Channel CANbus ModulePower Consumption: MAX 1.485WDimension: 30 x 51 x 4 mmOperating Temperature: -40-85 Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology CANbus mPCIe module
ADLINK Technology Interface Modules USB to dual isolated CANbus 2.0B ModulePower Consumption: MAX 3.33WDimension: 30 x 50.9 x 8.35 mmOperating Temperature: -40-85 Non-Stocked
Min.: 1
Mult.: 1