2 Gbit Tray Embedded Solutions

Types of Embedded Solutions

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Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS
Zentel Japan DRAM DDR3 2Gb, 256Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp. Non-Stocked Lead-Time 28 Weeks
Min.: 2.420
Mult.: 2.420

Zentel Japan DRAM DDR3L 2Gb, 256Mx8, 2133 at CL14, 1.35V, FBGA-78 Non-Stocked Lead-Time 24 Weeks
Min.: 2.420
Mult.: 2.420

Zentel Japan DRAM DDR3&DDR3L 2Gb, 128Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96 Non-Stocked Lead-Time 16 Weeks
Min.: 2.090
Mult.: 2.090

Zentel Japan DRAM DDR3 2Gb, 128Mx16, 2133 at CL14, 1.5V, FBGA-96 Non-Stocked Lead-Time 24 Weeks
Min.: 2.090
Mult.: 2.090

Zentel Japan DRAM DDR3 2Gb, 128Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp. Non-Stocked Lead-Time 28 Weeks
Min.: 2.090
Mult.: 2.090

Zentel Japan DRAM DDR3L 2Gb, 128Mx16, 2133 at CL14, 1.35V, FBGA-96 Non-Stocked Lead-Time 24 Weeks
Min.: 2.090
Mult.: 2.090

ISSI DRAM Automotive (Tc: -40 to +95C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

ISSI DRAM 2G 256Mx8 400MHz DDR2 1.8V Non-Stocked Lead-Time 52 Weeks
Min.: 242
Mult.: 242

ISSI DRAM 2G 128Mx16 1866MT/s 1.5V DDR3 I-Temp Non-Stocked Lead-Time 52 Weeks
Min.: 190
Mult.: 190

ISSI DRAM 2G 128Mx16 1866MT/s 1.5V DDR3 Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1

ISSI DRAM 2G 128Mx16 1866MT/s 1.35V DDR3L Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1

ISSI NOR Flash 2Gb QPI/QSPI, 24-ball LFBGA 6x8mm 5x5 ball array, RoHS, reset pin, Auto Grade, new die Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

ISSI DRAM Automotive (Tc: -40 to +95C), 2G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

ISSI DRAM 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

Alliance Memory DRAM DDR2, 2G, 256M x 8, 1.8v, 60-ball BGA, 400MHz, (A-die) Commercial Temp - Tray Non-Stocked
Min.: 1
Mult.: 1

Alliance Memory DRAM DDR3, 2G, 256M x 8, 1.35V, 78 -balll BGA, 800MHz, INDUSTRIAL temp - Tray Lead-Time 20 Weeks
Min.: 1
Mult.: 1

Alliance Memory DRAM LPDDR1, 2G, 64M x 32, 1.8v, 200 MHz 90-BALL FBGA, Commercial Temp - Tray Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

Alliance Memory DRAM LPDDR1, 2G, 64M x 32, 1.8v, 200 MHz 90-BALL FBGA, Industrial Temp - Tray Lead-Time 20 Weeks
Min.: 1
Mult.: 1

Alliance Memory AS4C128M16MD4V-062BAN
Alliance Memory DRAM LPDDR4X, 2Gb, 128M x 16, 0.6V, 200ball TFBGA, 1600MHZ, ECC, AUTO TEMP - Tray Non-Stocked Lead-Time 30 Weeks
Min.: 680
Mult.: 136

Alliance Memory AS4C128M16D3C-93BIN
Alliance Memory DRAM DDR3, 2Gb, 128M x 16, 1.5V, 96-ball FBGA, 2133MHz, Industrial Temp, C Die Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

Alliance Memory AS4C64M32MD4-062BAN
Alliance Memory DRAM LPDDR4, 2G, 64M x 32, 1.1V, 200 BALL TFBGA, 1600MHZ, ECC, Automotive Temp - Tray Non-Stocked Lead-Time 30 Weeks
Min.: 680
Mult.: 136

Alliance Memory AS5F32G04SNDB-08LIN
Alliance Memory NAND Flash SPI SLC NAND Flash, 2Gb, 3V, 120Mhz, Multiple IO, 4bit ECC, Industrial, 8pin LGA (8x6), revB Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1