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110110188

Name: Seeed Studio 110110188
Brand: Seeed Studio
SKU: 713-110110188
Price: 18327654 IDR
Availability: OutOfStock

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See Product Specifications

Mouser No:

713-110110188

Mfr. No:

110110188

Mfr.:

Seeed Studio

Description:

Single Board Computers reComputer Industrial J2011- Fanless Edge AI Device with Jetson Xavier NX 8GB module, Aluminum case with passive cooling, 2xRJ45 GbE, 1xRS232/RS-422/RS-485, 4xDI/DO, 1xCAN, 3xUSB3.2, Pre-installed JetPack System

Datasheet:

110110188 Datasheet (PDF)

More Information

Learn more about Seeed Studio 110110188

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Seeed Studio
Product Category:	Single Board Computers
RoHS:
Processor Brand:	NVIDIA
Processor Type:	Carmel, Volta
Core:	ARM v8.2, CUDA, Tensor
Operating Supply Voltage:	12 V to 24 V
Interface Type:	USB
Minimum Operating Temperature:	- 20 C
Maximum Operating Temperature:	+ 60 C
Dimensions:	159 mm x 155 mm x 57 mm
Brand:	Seeed Studio
Memory Size:	8 GB
Memory Type:	LPDDR4
Number of Cores:	1
Product Type:	Single Board Computers
Factory Pack Quantity:	1
Subcategory:	Computing

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Datasheet

110110188 Datasheet (PDF)

Compliance Codes

CAHTS:: 8471500090
USHTS:: 8471500150
JPHTS:: 847150000
TARIC:: 8471500000
MXHTS:: 8471500100
ECCN:: 5A992.C

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

reComputer Industrial Fanless Edge AI Devices

Seeed Studio reComputer Industrial Fanless Edge AI Devices offer full systems, including NVIDIA^® Jetson Xavier NX/Orin Nano/Orin NX modules. These devices combine the NVIDIA Ampere™ GPU architecture and 64-bit operating capability to provide 20 TOPS to 100 TOPS AI performance. The reComputer industrial edge AI devices come with pre-installed Jetpack 5.1 SDK, which includes NVIDIA technologies and CUDA-X accelerated libraries. These devices feature a passive heatsink and a fanless design. The fanless design with versatile mounting options enables deployment within a -20°C to 60°C temperature range, which is ideal for harsh environments and heavy loads. The passive heatsink enables efficient cooling without a fan and reduces the risk of component failure due to dust or other contaminants.